US 8,575,496 B2 · Multilayer printed wiring board and method of manufacturing the same

Abstract

A multilayer printed wiring board including a layered capacitor section provided on a first interlayer resin insulation layer and a high dielectric layer and first and second layered electrodes that sandwich the high dielectric layer. A second interlayer resin insulation layer is provided on the first insulation layer and the capacitor section, and a metal thin-film layer is provided over the capacitor section and on the second insulation layer. An outermost interlayer resin insulation layer is provided on the second insulation layer and the metal thin-film layer. A mounting section is provided on the outermost insulation layer and has first and second external terminals to mount a semiconductor element. Multiple via conductors penetrate each insulation layer. The via conductors include first via conductors that electrically connect the first layered electrode to the first external terminals. Second via conductors electrically connect the second layered electrode to the second external terminals.

Claims2

Dependent claims

A multilayer printed wiring board, comprising:

a layered capacitor section having a high dielectric layer and first and second layered electrodes sandwiching the high dielectric layer, where either the first or the second layered electrode is connected to a power-source line and the other layered electrode, which is not connected to the power-source line, is connected to a ground line to store a predetermined amount of electric charge;
a metal thin-film layer provided over the layered capacitor section on an interlayer resin insulation layer, wherein the metal thin film layer is a power-source plane layer which maintains the same electrical potential as the layered electrode which is connected to the power-source line and is a continuous metal layer over the layered capacitor section except for ground lands;
and a mounting section, provided over the metal thin-film layer on the interlayer resin insulation layer and configured to mount on a surface of the mounting section a semiconductor element electrically connected to the layered capacitor section through via holes.

Dependencies are inferred from the claim text.

Multilayer printed wiring board and method of manufacturing the same

Life of this patent

Multilayer printed wiring board and method of manufacturing the same

Life of this patent

Abstract

Claims2