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US 8,575,494 B2Granted
Printed circuit board with multi-layer ceramic capacitor array
AssigneeHon Hai Precision Industry Co., Ltd.
InventorChun-Yuan Tien
Life of this patent
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Abstract
A printed circuit board (PCB) includes a bank or matrix of multi-layer ceramic capacitors (MLCCs). Each MLCC includes positive and negative electrodes respectively connected to a power layer and a ground layer of the PCB through two positive and two negative vias. A portion of the positive vias and a portion of the negative vias utilized by the same column of MLCCs are arranged in two separated lines along the flowing direction of current streams in the power layer.
Claims8
A printed circuit board (PCB), comprising:
- a mounting surface defining an outline;
- a ground layer;
- a power layer positioned between the mounting surface and the ground layer, the power layer comprising a region, the region being configured to allow current streams to flow into the outline;
- a plurality of multi-layer ceramic capacitors (MLCCs) mounted to the mounting surface within the outline and arranged in a matrix, wherein the columns of the MLCCs are substantially parallel to the flowing direction of the current streams, each MLCC comprises a positive electrode and a negative electrode;
- a plurality of groups of positive vias, each group of positive vias running from the mounting surface to the power layer to connect a corresponding positive electrode to the power layer;
- and
- a plurality of groups of negative vias, each group of negative vias running from the mounting surface, through the power layer, to the ground layer to connect a corresponding negative electrode to the ground layer;
- wherein a portion of the positive vias and a portion of the negative vias corresponding to the same column of MLCCs are arranged in two separated lines along the flowing direction of the current streams.
5 more elements
Dependencies are inferred from the claim text.