Hole in pad thermal management

A device for providing efficient thermal transfer from a heat-generating component, the device comprising:

• a printed circuit board (PCB) defining a plurality of through holes, each through hole having two ends, the plurality of through holes being within a desired slug pad area,
• wherein the plurality of through holes comprises:
• a first layer of copper attached to a wall of each of the through holes, the first layer of copper has thickness of approximately 50μ;
• a second layer of copper attached to the first layer of copper within each of through holes, the second layer of copper has thickness of at least 12.7μ;
• a third layer of copper attached to the second layer of copper within each of through holes, the third layer of copper has thickness of approximately 75μ;
• and
• a filler material located adjacent to the third layer of copper,
• wherein and an area of the PCB surrounding the plurality of through holes is covered with a fourth layer of copper,
• wherein an exposed surface of the second and third layers of copper and an exposed surface of the filler material are flush and approximately parallel with a surface of the PCB,
• wherein each of the plurality of through holes has a diameter of less than 0.020 inches,
• wherein the plurality of through holes are spaced apart from each other by more than 0.015 inches.