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US 8,575,248 B2Granted
Polymer composition for microelectronic assembly
AssigneePromerus, LLC
InventorsChristopher Apanius, Andrew Bell, Leah Langsdorf, W. C. Peter Tsang
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Abstract
Embodiments in accordance with the present invention encompass polymer compositions that act as both a tack agent and a fluxing agent for the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions embodiments encompass a sacrificial polymer, a carrier solvent, a thermal acid generator and, optionally, formic acid.
Claims6
A polymer composition comprising:
- a sacrificial polymer comprising a polycarbonate having a molecular weight (Mw) from 5,000 to 200,000;
- a carrier solvent;
- formic acid;
- and
- a thermal acid generator/fluxing agent (TAG/FLAG).
2 more elements
A polymer composition comprising:
- a sacrificial polymer comprising a polycarbonate having a molecular weight (Mw) from 40,000 to 160,000;
- a carrier solvent;
- and
- a thermal acid generator/fluxing agent (TAG/FLAG) selected from di(4-tert-butylphenyl)iodonium trifluoromethanesulfonate (BBI OTF), dimethylanilinium tetrakis(pentafluorophenylborate), pyridinium trifluoromethanesulfonate, or mixtures thereof, where the TAG comprises from 2.5 to 8.0 pphr of the composition based on the total weight of polymer present;
- and
- where said polymer composition provides a fluxing activity.
3 more elements
Dependencies are inferred from the claim text.