Curing composition and cured product prepared by using the same

#This application is a 35 U.S.C. §371 National Stage entry of International Application No. PCT/KR2008/007667, filed on Dec. 24, 2008, and claims priority to Korean Application No. 10-2007-0140368, filed on Dec. 28, 2007, which are all hereby incorporated by reference in their entireties.

#The present invention relates to a curing composition and a cured product prepared by using the same, in which the curing composition can improve heat resistance, toughness, and cure degree of the cured product.

#This application claims priority from Korean Patent Application No. 10-2007-0140368 filed on Dec. 28, 2007 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.

#Hereinafter, the present invention will be described in more detail with reference to Examples. However, these Examples are for illustrative purposes only, and the invention is not intended to be limited by these Examples.

#A mixture A of 450 g of distilled water, 19.0 g of sodium hydroxide, 45.2 g of bisphenol A, 7.0 g of diallyllbisphenol A, 1.5 g of 2-allylphenol, and 0.5 g of benzyltriethylammonium chloride was added to a reactor that is provided with an agitator, and the temperature of the reactor was maintained at 25° C. Separately, 45.0 g of aromatic dicarboxylic acid chloride mixture B in which the same amounts of isophthalic acid chloride and terephthalic acid chloride were mixed with each other was dissolved in 620 g of methylene chloride. The mixture solution B was added to the reactor in which the alkali aqueous solution A was dissolved while the solution was stirred. After the stirring was performed for 1 hour, a hydrochloric acid was added, and the washing was then performed with distilled water. The washing was repeated until the conductivity of the water layer was 20 μs/cm or less, the resulting solution was poured onto methanol to perform phase separation of polymers. The polymers were filtered, and the drying was performed in a vacuum oven at 60° C. for 12 hours to remove the solvent. (Mw 32 k, Mn 16 k, Tg 163° C.)

#20 g of the above polyarylate was dissolved in 800 g of MC, and then 4.0 g of mCPBA (purity 70%) was added thereto. The mixture was left at room temperature for 24 hrs for epoxidation, and then precipitated with an excessive amount of ethanol. (Mw 32 k, Mn 16 k, Tg 173° C.)