Heat sink having a high thermal conductivity
AssigneePlansee SE
InventorArndt Lüdtke
Life of this patent
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Abstract
The invention relates to a heat sink comprising a diamond-containing composite material. In addition to a diamond content of 40-90% by volume, the composite material further comprises from 0.005 to 12% by volume of a silicon-carbon compound, from 7 to 49% by volume of an Ag-, Au- or Al-rich phase and less than 5% by volume of a further phase, with the volume ratio of the Ag-, Au or Al-rich phase to silicon carbide being greater than 4 and at least 60% of the diamond surface being covered by the silicon-carbon compound. Preferred production processes include atmospheric pressure and pressure-aided infiltration techniques. The component is suitable, in particular, as heat sink for semiconductor components.
Claims14
A heat sink component, comprising:
- a composite material containing free silicon and having
- a diamond content of from 40 to 90% by volume with diamond grains having a mean size of from 5 to 300 μm;
- 0.005 to 12% by volume of silicon carbide;
- 7 to 49% by volume of an Ag-rich, Au-rich, or Al-rich phase comprising Ag, Au, or Al, respectively, as a principal element;
- less than 5% by volume of a further phase;
- wherein a volume ratio of said Ag-rich, Au-rich, or Al-rich phase to said silicon carbide is greater than 4, and wherein at least 60% of a surface of said diamond grains is covered by said silicon carbide;
- said composite material being formed into a heat sink component.
Dependencies are inferred from the claim text.