Process to form semiconductor packages with external leads

A process for packaging semiconductor device with external leads comprises:

• Step 1:
• providing a lead frame comprising a plurality of lead frame units connected by a plurality of metal beams, each lead frame unit comprising a die pad and a plurality of leads extending away from the die pad;
• adhering a semiconductor chip onto each of the die pad, and providing a plurality of metal connections for electrically connecting each chip to its corresponding leads;
• Step 2 applying a plastic molding material to enclose the plurality of the lead frame units, the metal beams, the chips, and portions of the metal connections;
• Step 3 removing a portion of the plastic molding material above the metal beams to expose the metal beams and portions of the leads extending away from the die pad electrically connected to the semiconductor chip and disposed near-the metal beams on a top surface of the leadframe;
• Step 4 separating the lead frame units along the metal beams into a plurality of individual semiconductor plastic package components each encloses one of the lead frame units with the portions of the leads exposed functioning as external leads.