Method of manufacturing an electronic device having a plastic substrate and corresponding carrier

A method, comprising:

• providing a metallic layer on a carrier;
• providing a plastic substrate on said metallic layer, the metallic layer temporarily bonding the plastic substrate to the carrier;
• forming an electronic device on said plastic substrate;
• and
• releasing said carrier from said plastic substrate, said releasing including breaking bonds between said plastic substrate and said metallic layer using an oxygenated water solution, wherein said releasing includes:
• the metallic layer acting as a catalyst in a dismutation reaction that produces gaseous oxygen from the oxygenated water solution;
• and
• using the gaseous oxygen to break bonds between a plastic material of the plastic substrate and the metallic layer.