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US 8,575,004 B2Granted
Lift-off structure for substrate of a photoelectric device and the method thereof
AssigneeInstitute of Nuclear Energy Research Atomic Energy Council, Executive Yuan
InventorsYu-Li Tsai, Chih-Hung Wu, Jei-Li Ho, Chao-Huei Huang, Min-De Yang
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Abstract
The present invention related to a lift-off structure adapted to a substrate having a photoelectric device, the structure comprising: a buffer layer, forming on the substrate; an upper sacrificial layer, forming on the buffer layer; an etch stop layer, forming on the upper sacrificial layer, and the photoelectric device structure forming on the etch stop layer.
Claims7
A lift-off method, adapted for a substrate having a photoelectric element formed thereon, which comprises the steps of:
- providing a lift-off structure to be arranged between the substrate and the photoelectric element;
- forming an adhesive layer on the photoelectric element while enabling the adhesive layer to be formed with a plurality of patterns to be used for defining a plurality of chips as each pattern is formed the same as its corresponding chip in size;
- using an etching solution to perform an etching operation respectively upon the patterns formed on the adhesive layer;
- bonding a substrate with high heat-dissipating ability on the adhesive layer so as to form a wafer;
- sinking the wafer into an etching solution for enabling an epitaxial lift-off process to be performed thereupon;
- forming a plurality of metal electrodes on the photoelectric element;
- and
- dicing the wafer.
5 more elements
Dependencies are inferred from the claim text.