Method of manufacturing semiconductor device
AssigneeElpida Memory, Inc.
InventorTomoyasu Kakegawa
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a semiconductor device comprises: forming a processing target; forming a first supporter on the processing target; forming a first mask so as to contact one side surface of the first mask with a side surface of the first supporter; patterning the processing target using, as masks, the first mask and the first supporter; forming a second supporter so as to be contacted with a side surface of the processing target exposed in first processing step and the other side surface of the first mask; removing the first supporter; and patterning the processing target using, as masks, the first mask and the second supporter.
Claims20
A method of manufacturing a semiconductor device, comprising:
- (a) forming a processing target;
- (b) forming a first supporter on said processing target;
- (c) forming a first mask so as to contact one side surface of said first mask with a side surface of said first supporter;
- (d) patterning said processing target using, as masks, said first mask and said first supporter;
- (e) forming a second supporter so as to be contacted with a side surface of said processing target that is exposed in the (d) and the other side surface of said first mask;
- (f) removing said first supporter;
- and
- (g) patterning said processing target using, as masks, said first mask and said second supporter.
Dependencies are inferred from the claim text.