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US 8,574,966 B2Granted
Semiconductor device having a semiconductor chip, and method for the production thereof
AssigneeInfineon Technologies AG
InventorsMichael Bauer, Edward Fuergut
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Abstract
A semiconductor device having a semiconductor chip having an active surface with flip-chip contacts and a passive surface is disclosed. The flip-chip contacts are surrounded by an electrically insulating layer as underfill material, the layer having a UV B-stageable material. The UV B-stageable material is applied on the active surface of the semiconductor wafer.
Claims9
A method for producing a semiconductor device, comprising:
- providing a semiconductor chip having an active surface, an opposing passive surface, and planar side edges extending between the active surface and the passive surface;
- applying flip-chip contacts to the active surface;
- and
- after applying the flip-chip contacts to the active surface, applying a UV B-stageable material as an electrically insulating layer surrounding the flip-chip contacts as underfill material, such that the electrically insulating material layer extends across the active surface and has edges coplanar with and not extending beyond the planar side edges of the semiconductor chip.
1 more element
Dependencies are inferred from the claim text.