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US 8,574,965 B2Granted
Semiconductor chip device with liquid thermal interface material
AssigneesATI Technologies ULC, Advanced Micro Devices, Inc.
InventorsGamal Refai-Ahmed, Michael Z. Su, Bryan Black
Life of this patent
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Abstract
A method of manufacturing is provided that includes providing a semiconductor chip device that has a circuit board and a first semiconductor chip coupled thereto. A lid is placed on the circuit board. The lid includes an opening and an internal cavity. A liquid thermal interface material is placed in the internal cavity for thermal contact with the first semiconductor chip and the circuit board.
Claims23
A method of manufacturing, comprising:
- providing a semiconductor chip device including a circuit board and a first semiconductor chip coupled thereto;
- placing a lid on the circuit board, the lid including an opening and an internal cavity in which the first semiconductor chip is positioned;
- and
- placing a liquid thermal interface material in the internal cavity to encompass the first semiconductor chip and to establish thermal contact with the first semiconductor chip and the circuit board, the liquid thermal interface material being operable to be in a liquid state during operation of the first semiconductor chip.
1 more element
A method of manufacturing, comprising:
- providing a semiconductor chip package including a package substrate and a first semiconductor chip coupled thereto;
- placing a lid on the package substrate, the lid including an opening and an internal cavity in which the first semiconductor chip is positioned;
- and
- placing a liquid thermal interface material in the internal cavity to encompass the first semiconductor chip and to establish thermal contact with the first semiconductor chip and the circuit board, the liquid thermal interface material being operable to be in a liquid state during operation of the first semiconductor chip.
1 more element
An apparatus, comprising:
- a circuit board;
- a first semiconductor chip coupled to the circuit board;
- a lid coupled to the circuit board, the lid including an opening and an internal cavity in which the first semiconductor chip is positioned;
- and
- a liquid thermal interface material in the internal cavity encompassing the first semiconductor chip and in thermal contact with the first semiconductor chip and the circuit board, the liquid thermal interface material being operable to be in a liquid state during operation of the first semiconductor chip.
2 more elements
Dependencies are inferred from the claim text.