Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape

A method of making a semiconductor device, comprising:

• forming a continuous body of conductive material;
• providing a semiconductor die with contact pads;
• providing a substrate with contact pads;
• depositing a flux material over the contact pads of the semiconductor die and the contact pads of the substrate;
• disposing the continuous body of conductive material between the contact pads of the semiconductor die and the contact pads of the substrate;
• and
• bringing the conductive material to a liquidus state to separate a portion of the continuous body outside a footprint of the contact pads of the semiconductor die and the contact pads of the substrate.

A method of making a semiconductor device, comprising:

• forming a continuous body of an interconnect material;
• providing a semiconductor die with contact pads;
• providing a substrate with contact pads;
• disposing the continuous body of interconnect material between the contact pads of the semiconductor die and the contact pads of the substrate;
• and
• reflowing the interconnect material to separate a portion of the continuous body outside a footprint of the contact pads of the substrate.

A method of making a semiconductor device, comprising:

• forming a continuous body of conductive material;
• providing a semiconductor die including first contact pads;
• providing a substrate including second contact pads;
• disposing the continuous body of conductive material between the semiconductor die and substrate;
• and
• reflowing the continuous body into interconnects between the first contact pads and second contact pads of conductive material to separate portions of the continuous body.