Method of manufacturing semiconductor device
AssigneeRenesas Electronics Corporation
InventorHiroshi Kuroda
Life of this patent
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Abstract
Occurrence of a void is suppressed when mounting semiconductor chips over a wiring substrate via a paste-like adhesive material. A die bonding step is provided which mounts semiconductor chips over a chip-mounting region of the wiring substrate via the adhesive material. The wiring substrate includes a plurality of wirings (first wirings) and dummy wirings (second wirings) formed on an upper surface of a core layer. The chip-mounting region is provided over the first wirings and the second wirings. In addition, the die bonding step includes a step of applying the adhesive material over an adhesive material application region over the chip-mounting region. Each of the second wirings is extended along a direction in which the adhesive material spreads in the die bonding step.
Claims14
A method of manufacturing a semiconductor device comprising the steps of:
- (a) providing a wiring substrate including a core layer having an upper surface and a lower surface opposite to the upper surface, a plurality of first and second wirings formed on the upper surface of the core layer, a plurality of bonding leads formed on the upper surface of the core layer and electrically coupled to the first wirings, an upper surface-side insulating film formed on the upper surface of the core layer such that the first and second wirings are covered, and such that the bonding leads are exposed, a plurality of lands formed on the lower surface of the core layer and electrically coupled to the bonding leads respectively, and a lower surface-side insulating film formed on the lower surface of the core layer such that the lands are exposed;
- (b) applying a first flowable adhesive material to a first adhesive material application region in a first chip-mounting region, a shape in a plan view of the first adhesive material application region is rectangular, the first chip-mounting region being provided over the upper surface of the core layer;
- and
- (c) mounting a first semiconductor chip, having a first front surface, a plurality of first electrode pads formed on the first front surface, and a first rear surface opposite to the first front surface, in the first chip-mounting region of the wiring substrate via the first adhesive material, and spreading the first adhesive material around the first adhesive material application region, a shape in the plan view of the first semiconductor chip is rectangular,
- wherein the first chip-mounting region has the first and second wirings,
- wherein in the step (b), the first adhesive material is applied to the first adhesive material application region provided on a first centerline connecting each center of two short sides facing each other in the first chip-mounting region, and extending along the first centerline, and
- wherein each of the second wirings is extended along a direction in which the first adhesive material spreads in the step (c).
A method of manufacturing a semiconductor device comprising the steps of:
- (a) providing a wiring substrate including, a core layer having an upper surface and a lower surface opposite to the upper surface, a plurality of first and second wirings formed on the upper surface of the core layer, a plurality of bonding leads formed on the upper surface of the core layer and electrically coupled to the first wirings, an upper surface-side insulating film formed on the upper surface of the core layer such that the first and second wirings are covered, and such that the bonding leads are exposed, a plurality of lands formed on the lower surface of the core layer and electrically coupled to the bonding leads respectively, and a lower surface-side insulating film formed on the lower surface of the core layer such that the lands are exposed;
- (b) applying a flowable adhesive material to an adhesive material application region in a chip-mounting region which is provided on the upper surface side of the core layer, a shape in a plan view of the adhesive material application region is quadrangular;
- and
- (c) mounting, over the chip-mounting region of the wiring substrate via the adhesive material, a semiconductor chip having a surface, a plurality of electrode pads formed on the surface, and a rear surface opposite to the surface, and spreading the adhesive material around the adhesive material application region, a shape in the plan view of the semiconductor chip is quadrangular,
- wherein the chip-mounting region has the first and second wirings, and
- wherein each of the second wirings is extended toward a nearest side of the chip-mounting region, among four sides of the chip-mounting region, from a side of the adhesive material application region.
Dependencies are inferred from the claim text.