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US 8,574,961 B2Granted
Method of marking a low profile packaged semiconductor device
AssigneeSemiconductor Components Industries, LLC
InventorsJames Howard Knapp, Jay A. Yoder, Harold G. Anderson
Life of this patent
Estimating the term…
Abstract
A semiconductor device (10) is made by mounting the bottom surfaces (31, 44, 54) of a semiconductor die (14) and a lead (15, 17) on a tape (12) and over a hole (19) in the tape. A vacuum is drawn through the hole to secure the die in place when the lead's top surface (43) is wirebonded to a top surface (32) of the semiconductor die. A molding material (49) is formed to encapsulate the top surface of the semiconductor die and to expose its bottom surface.
Claims10
A method of making a semiconductor device, comprising:
- providing a semiconductor die having first and second opposed surfaces, wherein the semiconductor die has a solderable metal layer formed overlying the second surface;
- providing a tape having an adhesive surface and a hole extending completely through the tape;
- mounting the semiconductor die on the adhesive surface of the tape, wherein the semiconductor die covers the hole and a portion of the solderable metal layer is exposed through the hole;
- drawing a vacuum through the hole to secure the semiconductor die;
- attaching a wirebond to the first surface of the semiconductor die and to a lead disposed on the tape while drawing the vacuum;
- forming an encapsulating layer overlying the wirebond, at least a portion of the lead and at least a portion of the semiconductor die while the tape is attached to the solderable metal layer;
- and
- removing the tape so that surfaces of the lead and the solderable metal layer are exposed to provide package leads, wherein the exposed solderable metal layer provides an electrical contact for the semiconductor device when the semiconductor device is mounted to an electronic system.
5 more elements
A method of making a semiconductor device, comprising:
- providing a tape having an adhesive surface and a hole extending completely through the tape;
- mounting a leadframe having a conductive lead to the adhesive surface, wherein the leadframe has an opening surrounding the hole;
- mounting a first surface of a semiconductor die to the adhesive surface so that the semiconductor die is within the opening and covers the hole, wherein the first surface comprises a solderable metal layer formed overlying the semiconductor die;
- drawing a vacuum through the hole to secure the semiconductor die while attaching a first end of a bonding wire to a second surface of the semiconductor die and a second end of the bonding wire to the conductive lead;
- encapsulating the bonding wire and the second surface of the semiconductor die and a second surface the conductive lead with an encapsulant;
- exposing a first surface of the lead and the solderable metal through the encapsulant to provide package leads, wherein the solderable metal layer is configured as an electrical contact for semiconductor device when the semiconductor device is mounted to an electronic system;
- and
- singulating through the encapsulant and a portion of the leadframe.
5 more elements
Dependencies are inferred from the claim text.