Method for manufacturing semiconductor device

A method for manufacturing a semiconductor device comprising the steps of:

• (1) providing a water-repellant stamp substrate having an indented water-repellant surface and coating a solution containing an organic semiconductor material onto the indented water-repellant surface according to an indented pattern thereof;
• (2) drying the organic semiconductor material-containing solution coated on the water-repellant surface of said stamp substrate to crystallize the organic semiconductor material, thereby forming an organic semiconductor layer;
• (3) thermally treating said organic semiconductor layer formed on said stamp substrate;
• and
• (4) after thermally treating said semiconductor layer, pressing said stamp substrate at a side where the thermally treated organic semiconductor layer is formed against a surface of an insulating layer of a substrate to be transferred, thereby causing the pattern of said organic semiconductor layer formed at top faces of protrusions to be transferred to the surface of said insulating layer to be transferred,
• wherein a contact surface of the organic semiconductor layer that is in contact with the water repellant surface of the stamp substrate is disposed at a side of the organic semiconductor layer that is positioned away from the insulating layer.

A method for manufacturing a semiconductor device, the method comprising:

• (1) coating a solution containing an organic semiconductor material on a water-repellent surface of a water-repellent stamp substrate;
• (2) drying the thus coated organic semiconductor material-containing solution on the water-repellent surface to crystallize the organic semiconductor material in contact with the water-repellent surface, thereby forming a semiconductor layer;
• (3) thermally treating said semiconductor layer formed on said stamp substrate;
• and
• (4) pressing said stamp substrate at a side, in which the thermally treated organic semiconductor layer is formed, against a surface of a substrate to be transferred so that said organic semiconductor layer is transferred to the surface of said substrate to be transferred,
• wherein said substrate to be transferred includes a gate insulating film formed on said substrate through a gate electrode,
• wherein a source electrode and a drain electrode are formed on said gate insulating film prior to or after the step (4), and
• wherein said organic semiconductor layer is transferred to a surface of said insulating film in the step (4) so that a channel layer made of said organic semiconductor layer is foamed between said source electrode and said drain electrode.