Resist composition for immersion exposure and method of forming resist pattern
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorMakiko Irie
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Abstract
A resist composition for immersion exposure and a method of forming a resist pattern which can satisfy both of excellent resistance to an immersion medium and lithography properties. The resist composition for immersion exposure includes a resin component (A) which exhibits changed alkali solubility under action of acid and an acid-generator component (B) which generates acid upon irradiation, the resin component (A) including a resin (A1) which contains a fluorine atom and a resin (A2) which has a structural unit (a′) derived from acrylic acid and contains no fluorine atom, and the amount of the resin (A1) contained in the resin component (A) being within the range from 0.1 to 50% by weight.
Claims10
A resist composition for immersion exposure comprising a resin component (A) which exhibits changed alkali solubility under action of acid and an acid-generator component (B) which generates acid upon irradiation,
- wherein said resin component (A) comprises a resin (A1) which has a structural unit (a) derived from acrylic acid containing a fluorinated hydroxyalkyl group represented by general formula (I) shown below and a structural unit (a1) selected from the group consisting of structural units represented by general formulas (a1-0-1) and (a1-0-2) shown below,
- wherein x represents an integer of 0 to 5;
- and y and z each independently represents an integer of 1 to 5,
- wherein, R represents a hydrogen atom, halogen atom, lower alkyl group, or halogenated lower alkyl group;
- and X1 represents an acid dissociable, dissolution inhibiting group,
- wherein, R represents a hydrogen atom, halogen atom, lower alkyl group, or halogenated lower alkyl group;
- X2 represents an acid dissociable, dissolution inhibiting group;
- and Y2 represents an alkylene group or an aliphatic cyclic group;
- and
- a resin (A2) which has a structural unit (a′) derived from acrylic acid and contains no fluorine atom, wherein
- the amount of said resin (A1) contained in said resin component (A) is within a range from 0.1 to 20% by weight.
Dependencies are inferred from the claim text.