Methods and apparatus for applying adhesives in patterns to an advancing substrate

A method for applying adhesive discharged from a slot die applicator to a substrate in a pattern, the slot die applicator including a slot opening, a first lip, and a second lip, the slot opening located between the first lip and the second lip;

• and the substrate having a first surface disposed opposite of a second surface and an unconstrained caliper, Hs, the method comprising the steps of:
• continuously advancing the substrate in a machine direction;
• engaging the substrate with a substrate carrier, the substrate carrier comprising:
• a pattern element, wherein the pattern element includes a pattern surface;
• positioning the substrate carrier adjacent the slot die applicator to define a minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip that is less than the unconstrained caliper, Hs, of the substrate;
• advancing the second surface of the substrate past the slot die applicator while the first surface of the substrate is disposed on the substrate carrier;
• intermittently compressing the substrate between the slot die applicator and the pattern surface of the pattern element by advancing the pattern element such that the pattern surface of the pattern element advances past the first lip, the slot opening, and the second lip of the slot die applicator while the first surface of the substrate is disposed on the substrate carrier;
• discharging adhesive from the slot opening of the slot die applicator onto the second surface of the substrate;
• wherein the substrate carrier further comprises a base surface, wherein the pattern element protrudes from the base surface to define a distance, Hp, between the pattern surface and the base surface;
• and
• wherein the substrate carrier is positioned adjacent the slot die applicator to define a minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip that is less than the unconstrained caliper, Hs, of the substrate such that a sum of the distance, Hp, and distance, Hg, is greater than the unconstrained caliper, Hs, of the substrate.