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US 8,574,513 B2Granted
Single-layer PCB microfluidics
AssigneeCalifornia Institute of Technology
InventorsSamson Chen, Aditya Rajagopal, Axel Scherer
Life of this patent
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Abstract
A printed circuit board structure is coated with an encapsulant within which microfluidic channels have been formed. The microfluidic channels are formed by soldering fluidic connections to metal traces on a surface of the printed circuit board structure prior to encapsulation. The metal traces are removed by etching after encapsulation to form microchannels within the encapsulant.
Claims9
A microfluidic structure comprising:
- a substrate encapsulated in an encapsulant;
- one or more microfluidic channels disposed on or within the substrate;
- and,
- at least one fluidic connection soldered to the substrate or metallic structures disposed on the substrate and wherein the at least one fluidic connection is in fluidic communication with at least one microfluidic channel of the one or more microfluidic channels and is configured to enable flow of an etchant to or from the at least one microfluidic channel and some portion of the at least one fluidic connection is encapsulated within the encapsulant.
1 more element
Dependencies are inferred from the claim text.