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US 8,574,414 B2Granted
Copper prerinse for electrodepositable coating composition comprising yttrium
AssigneePPG Industries Ohio, Inc.
InventorsTerri Ziegler, Mark McMillen
Life of this patent
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Abstract
A method includes (a) contacting at least a portion of a substrate material with a solution comprising a source of copper, wherein the solution is essentially free of a source of a group IIIB metal and a source of a group IVB metal; and (b) after step (a), contacting at least a portion of the substrate with an electrodepositable coating composition comprising (i) a film-forming resin and (ii) a source of yttrium.
Claims20
A method comprising:
- (a) contacting at least a portion of a substrate with a solution comprising a source of copper, wherein the solution is essentially free of a source of a group IIIB metal and a source of a group IVB metal;
- and
- (b) after step (a), contacting at least a portion of the substrate with an electrodepositable coating composition with no pretreatment step performed between steps (a) and (b), the electrodepositable coating composition comprising:
- (i) a film-forming resin;
- and
- (ii) a source of yttrium.
3 more elements
A method comprising:
- (a) contacting at least a portion of a substrate with a solution consisting essentially of:
- (i) a source of copper;
- (ii) water;
- and
- (iii) at least one of an acid and a surfactant;
- (b) after step (a), contacting at least a portion of the substrate with an electrodepositable coating composition with no pretreatment step performed between steps (a) and (b), the electrodepositable coating composition comprising:
- (i) a film-forming resin;
- and
- (ii) a source of yttrium.
6 more elements
Dependencies are inferred from the claim text.