Method and apparatus for improved high power impulse magnetron sputtering
AssigneeThe Regents of the University of California
InventorAndre Anders
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Abstract
A high power impulse magnetron sputtering apparatus and method using a vacuum chamber with a magnetron target and a substrate positioned in the vacuum chamber. A field coil being positioned between the magnetron target and substrate, and a pulsed power supply and/or a coil bias power supply connected to the field coil. The pulsed power supply connected to the field coil, and the pulsed power supply outputting power pulse widths of greater that 100 μs.
Claims24
A high power impulse magnetron sputtering apparatus comprising:
- a vacuum chamber;
- a magnetron target positioned in said vacuum chamber;
- a substrate positioned inside said vacuum chamber and away from said magnetron target;
- a magnetron anode positioned in said vacuum chamber, said anode being connected to an electrical ground;
- a field coil positioned between said magnetron target and said substrate and configured to generate a magnetic field when energized;
- a pulsed coil power supply connected to said field coil;
- a pulsed magnetron high voltage power supply connected to said magnetron target and said magnetron anode;
- a synchronization line connection between said pulsed magnetron high voltage power supply and said pulsed coil power supply;
- a substrate bias voltage power supply connected to said substrate and configured to generate an electric field to direct and focus ionized sputter material onto said substrate;
- and,
- a coil bias power supply connected to said field coil and to said magnetron anode and configured to apply an electric voltage bias to said field coil to assist the generated magnetic field to direct and focus ionized sputter vapors onto said substrate.
A method for high power impulse magnetron sputtering comprising:
- providing a magnetron target positioned inside a vacuum chamber;
- providing a grounded magnetron anode inside said vacuum chamber;
- positioning a substrate inside said vacuum chamber and away from said magnetron target;
- positioning a field coil between said magnetron target and said substrate;
- providing a pulsed coil power supply that is connected to said field coil;
- providing a synchronization line connected to a pulsed magnetron high voltage power supply and connected to said pulsed coil power supply;
- and,
- providing an electric field between said field coil and said grounded magnetron anode to attract ionized sputter material from said magnetron target to said substrate.
A high power impulse magnetron sputtering apparatus comprising:
- a vacuum chamber;
- a magnetron including a magnetron target positioned in said vacuum chamber;
- a substrate positioned inside said vacuum chamber and away from said magnetron target;
- a field coil positioned between said magnetron target and said substrate;
- a pulsed power supply connected to said field coil and configured to produce a pulsed magnetic field between said magnetron target and said substrate;
- a high voltage power supply;
- and,
- a synchronization line connection between said high voltage power supply and said pulsed power supply.
A method for high power impulse magnetron sputtering comprising:
- providing a magnetron target positioned inside a vacuum chamber;
- positioning a substrate inside said vacuum chamber and away from said magnetron target;
- positioning a field coil between said magnetron target and said substrate;
- using said field coil to produce a pulsed magnetic field to guide ionized sputter material from said magnetron target to said substrate;
- providing a pulsed coil power supply connected to said field coil to produce the pulsed magnetic field;
- and,
- providing a synchronization line interconnecting said pulsed coil power supply to a pulsed magnetron high voltage power supply to control when said pulsed power supplies output synchronized power pulses.
Dependencies are inferred from the claim text.