Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers
AssigneeSuss Microtec Lithography GmbH
InventorGregory George
Life of this patent
Estimating the term…
Abstract
An apparatus for removing an adhesive layer from a wafer surface includes a chuck, a contact roller, a pick-up roller and a detaping tape. The chuck supports and holds a wafer that has an adhesive layer on its top surface. The contact roller rotates around a first axis and moves linearly along a direction perpendicular to the first axis over the chuck and the supported wafer. The pick-up roller rotates around a second axis, that is parallel to the first axis. The detaping tape rolls around the contact roller and the pick-up roller, and as it rolls it attaches to the adhesive layer, and then is removed together with the adhesive layer. The contact roller has a surface that has a footprint of a circle when rolled along a flat surface.
Claims16
An apparatus for removing an adhesive layer from a wafer surface, comprising:
- a chuck configured to support and hold a wafer, wherein said wafer comprises an adhesive layer on its top surface;
- a contact roller comprising an elongated cylindrical body extending along a first axis passing through its center and being configured to rotate around said first axis and to move linearly along a direction perpendicular to said first axis over said chuck and said supported wafer;
- a pick-up roller comprising an elongated cylindrical body extending along a second axis passing through its center and being configured to rotate around said second axis and wherein said second axis is parallel to said first axis and said pick-up roller is arranged at a first distance from the contact roller;
- a detaping tape configured to roll around said contact roller and said pick-up roller, and wherein said detaping tape is configured to attach to said adhesive layer and then to be removed together with the adhesive layer;
- wherein said contact roller comprises a surface layer that has a footprint of a circle when rolled along a flat surface;
- and
- wherein said contact roller further comprises means for attaching said detaping tape onto said adhesive layer by rotating around said first axis so that it moves linearly along a first direction over said wafer and contacts said adhesive layer with said surface layer.
A method for removing an adhesive layer from a wafer surface, comprising:
- providing a chuck configured to support and hold a wafer, wherein said wafer comprises an adhesive layer on its top surface;
- providing a contact roller comprising an elongated cylindrical body extending along a first axis passing through its center and being configured to rotate around said first axis and to move linearly along a direction perpendicular to said first axis over said chuck and said supported wafer;
- providing a pick-up roller comprising an elongated cylindrical body extending along a second axis passing through its center and being configured to rotate around said second axis and wherein said second axis is parallel to said first axis and said pick-up roller is arranged at a first distance from the contact roller;
- providing a detaping tape configured to roll around said contact roller and said pick-up roller, and wherein said detaping tape is configured to attach to said adhesive layer and then to be removed together with the adhesive layer;
- wherein said contact roller comprises a surface layer that has a footprint of a circle when rolled along a flat surface;
- and
- attaching said detaping tape onto said adhesive layer by rotating said contact roller around said first axis and linearly moving said contact roller along a first direction over said wafer and contacting said adhesive layer with said surface layer.
Dependencies are inferred from the claim text.