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US 8,574,394 B2Granted
Method for preparing a moisture curable hot melt adhesive
AssigneeHenkel AG & Co. KGaA
InventorYongxia Wang
Life of this patent
Estimating the term…
Abstract
Moisture curable reactive hot melt adhesive compositions are prepared using a novel two-step polymerization process. Resulting adhesives have improved green strength.
Claims15
A method of forming a moisture curable hot melt adhesive comprising:
- forming an isocyanate terminated prepolymer by reacting at least one of 4,4′ methylene bisphenyl diisocyanate (MDI), hydrogenated 4,4′ methylene bisphenyl diisocyanate (MDI) and hexamethylene diisocyanate with at least one polyol, wherein the polyol is not a polyhydroxy ester of alkyl fatty acids or an ethylene oxide adduct of a polyol, and
- (ii) chain extending said prepolymer by reaction with a chain extender including at least one of ethylene glycol, 1,4-butane diol, 1,6-hexane diol, 1,4-bis(hydroxymethyl)cyclohexane, p-di(2-hydroxyethoxy)benzene, m-di(2-hydroxyethoxy)benzene (HER), trimethylolpropane (TMP) and 2,4-diamino-3,5-diethyltoluene to form an isocyanate terminated moisture curable hot melt adhesive.
A method of forming a moisture curable hot melt adhesive comprising:
- forming an isocyanate terminated prepolymer by reacting an excess of 4,4′ methylene bisphenyl diisocyanate (MDI), hydrogenated 4,4′ methylene bisphenyl diisocyanate (MDI) and hexamethylene diisocyanate with a mixture of polyether polyol and non-polyether polyol, and
- chain extending the prepolymer by reaction with a chain extender including at least one of ethylene glycol, 1,4-butane diol, 1,6-hexane diol, 1,4-bis(hydroxymethyl)cyclohexane, p-di(2-hydroxyethoxy)benzene, m-di(2-hydroxyethoxy)benzene (HER), trimethylolpropane (TMP) and 2,4-diamino-3,5-diethyltoluene to the isocyanate terminated prepolymer to form the moisture curable hot melt adhesive.
Dependencies are inferred from the claim text.