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US 8,574,033 B2Granted
Wafer support member, method for manufacturing the same and wafer polishing unit comprising the same
AssigneeLG Siltron Inc.
InventorJae Chel Sung
Life of this patent
Estimating the term…
Abstract
Disclosed is a wafer support member including a base substrate, a support adhered at a predetermined width to the edge of the base substrate, the support having a round outermost part, and a coating layer provided on the outermost edge of the support.
Claims14
A wafer support member, comprising:
- a base substrate;
- a support including at least two layers, the support being adhered at a predetermined width to the edge of the base substrate, the support having a round outermost part, the round outermost part extending between a top surface and a lateral side surface of the support such that an edge formed between the top and lateral side surface of the support is rounded;
- and
- a coating layer provided on a first portion of the support such that a second portion of the support is exposed, wherein the first portion of the support includes the round outermost part of the support, and wherein a curvature of the at least two layers at the round outermost part of the support is the same.
1 more element
A wafer polishing unit, comprising:
- a wafer support member to support a wafer;
- a pressurizing unit to apply pressure to the wafer support member;
- and
- a pressure-supplying unit to supply pressure to the pressurizing unit,
- wherein the wafer support member includes a base substrate, a support adhered at a predetermined width to the edge of the base substrate, the support having a round outermost part and the support including at least two layers, the round outermost part extending between a top surface and a lateral side surface of the support such that an edge formed between the top and lateral side surface of the support is rounded, and a coating layer provided on a first portion of the support such that a second portion of the support is exposed, the first portion including the round outermost part of the support, wherein a curvature of the at least two layers at the round outermost part of the support is the same.
2 more elements
Dependencies are inferred from the claim text.