Wide-array inkjet printhead assembly
AssigneeHewlett-Packard Development Company, L.P.
InventorsSilam J. Choy, Patrick V. Boyd
Life of this patent
Estimating the term…
Abstract
A wide-array inkjet printhead assembly with die carriers includes a backbone which delivers fluid through a manifold with a number of openings. The openings are spaced apart according to a opening pitch. A plurality of inkjet die includes trenches with a trench pitch which is smaller than the opening pitch. A plurality of die carriers include a plurality of oblique tapered channels, with one end of the oblique tapered channels having pitch matching the opening pitch and interfacing with the backbone and the opposite end of the oblique tapered channels having a pitch matching the trench pitch and interfacing with the inkjet die. A method for assembling a wide-array inkjet printhead assembly is also described.
Claims15
A wide-array inkjet printhead assembly comprising:
- a backbone including a manifold for delivery of fluid through a number of openings, the openings having a opening pitch;
- a plurality of inkjet die, the inkjet die comprising trenches with a trench pitch which is smaller than the opening pitch;
- and
- a plurality of die carriers, the die carriers comprising a plurality of oblique tapered channels, one end of the oblique tapered channels having a pitch matching the opening pitch and interfacing with the backbone and the opposite end of the oblique tapered channels having a pitch matching the trench pitch and interfacing with the inkjet die.
A die carrier comprising:
- a first planar surface;
- a second planar surface;
- a plurality of oblique tapered channels extending through the die carrier from the first planar surface to the second planar surface, the oblique tapered channels having a first pitch at the first planar surface and a second smaller pitch at the second planar surface, the first planar surface interfacing with manifold openings in a backbone of a printhead assembly and the second planar surface interfacing with trenches in an inkjet die.
A method for assembling a wide-array inkjet printhead assembly comprises:
- attaching a inkjet die to a die carrier such that trenches on the inkjet die are in fluidic communication with oblique tapered channels which extend through the die carrier;
- attaching a flex cable to the die carrier to form a die assembly;
- attaching a plurality of the die assemblies to a backbone in back-to-back staggered configuration, such that the die assemblies extend across a substantial portion of the backbone and flex cables for each die assembly extend to one side of the printhead;
- in which the oblique tapered channels in the plurality of die assemblies are in fluidic communication with manifold openings in the backbone.
Dependencies are inferred from the claim text.