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US 8,573,469 B2Granted
Method of forming a micro LED structure and array of micro LED structures with an electrically insulating layer
AssigneeLuxVue Technology Corporation
InventorsHsin-Hua Hu, Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law
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Abstract
A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.
Claims30
A method of forming a micro LED array in the following sequence comprising:
- bonding a first substrate stack to a second substrate stack with a bonding layer;
- wherein the first substrate stack comprises:
- a p-n diode layer formed on a first substrate;
- a plurality of separate reflective metallization stacks on the p-n diode layer;
- a patterned electrically insulating layer laterally between the plurality of separate reflective metallization stacks on the p-n diode layer;
- removing the first substrate;
- and
- etching through the p-n diode layer to form a plurality of micro p-n diodes over the plurality of separate reflective metallization stacks, and exposing the patterned electrically insulating layer laterally between the plurality of micro p-n diodes, wherein the patterned electrically insulating layer acts as an etch stop layer during the etching.
5 more elements
Dependencies are inferred from the claim text.