Ultrasonic bonding systems and methods of using the same
AssigneeOrthodyne Electronics Corporation
InventorsChristoph B. Luechinger, Orlando L. Valentin, Tao Xu
Life of this patent
Estimating the term…
Abstract
An ultrasonic bonding machine is provided. The ultrasonic bonding machine includes a support structure configured to support a workpiece during a bonding operation. The ultrasonic bonding machine further includes an upper bonding tool positioned above the support structure and configured for bonding an upper bonding material to an upper side of the workpiece, and a lower bonding tool positioned below the support structure and configured for bonding a lower bonding material to a lower side of the workpiece. The ultrasonic bonding machine may also be an ultrasonic ribbon bonding machine configured to bond an upper and lower conductive ribbon to a solar substrate.
Claims68
A method of bonding a workpiece, the method comprising the steps of:
- a) supporting a workpiece with a support structure during a wire bonding operation;
- b) ultrasonically bonding an upper bonding material to an upper side of the workpiece using an upper wire bonding tool positioned above the workpiece;
- and
- c) ultrasonically bonding a lower bonding material to a lower side of the workpiece using a lower wire bonding tool positioned below the workpiece.
An ultrasonic ribbon bonding machine comprising:
- a) a solar substrate support structure configured to support a solar substrate during a ribbon bonding operation;
- b) an ultrasonic upper ribbon bonding tool positioned above the solar substrate support structure and configured for bonding a first conductive ribbon to an upper side of the solar substrate;
- and
- c) an ultrasonic lower ribbon bonding tool positioned below the solar substrate support structure and configured for bonding a second conductive ribbon to a lower side of the solar substrate.
A method of bonding a solar substrate, the method comprising the steps of:
- a) supporting a solar substrate with a solar substrate support structure during a ribbon bonding operation;
- b) ultrasonically bonding a first conductive ribbon to an upper side of the solar substrate using an upper ribbon bonding tool positioned above the solar substrate;
- and
- c) ultrasonically bonding a second conductive ribbon to a lower side of the solar substrate using a lower ribbon bonding tool positioned below the solar substrate.
Dependencies are inferred from the claim text.