Wafer inspection system and a method for translating wafers
AssigneeCamtek Ltd.
InventorsItzik Nisany, Amir Gilead, Michael Vainer, Valery Nuzni
Life of this patent
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Abstract
A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck.
Claims13
A wafer inspection system that comprises:
- a chuck;
- and
- a robot, comprising a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors;
- wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer;
- and
- wherein the robot is adapted to fetch an object selected out of a diced wafer and a non-diced wafer from a cassette and to place the object on the chuck.
A method for translating a wafer, the method comprises:
- selecting a detachable adaptor in response to a size and a shape of an object;
- fetching the object from a cassette by placing the object on the selected detachable adaptor and applying vacuum;
- and
- placing the object on a chuck;
- wherein the method is executed by an inspection system that comprises the chuck and a robot;
- wherein the robot comprises a movable element connected to the detachable adaptor selected from the group of diced wafer detachable adaptors and the non-diced wafer detachable adaptors;
- wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on the tape that supports the diced wafer;
- and wherein the robot is adapted to fetch the object and to place the object on the chuck.
Dependencies are inferred from the claim text.