Fabrication method for multi-piece board
AssigneeIbiden Co., Ltd.
InventorYasushi Hasegawa
Life of this patent
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Abstract
A fabrication method for a multi-piece board having a frame part and multi piece parts each having a printed wiring board includes producing the frame part having a first coupling portion, and the multi-piece parts including piece parts each having a second coupling portion coupled to the first coupling portion at a production panel with at least the frame part and the piece parts being separated from each other, separating the frame part and the multi-piece parts from the production panel, and coupling the first coupling portion to the second coupling portion to couple the frame part and the piece parts and combine the frame part and the multi piece parts so as to yield the multi-piece board.
Claims18
A method for fabricating a multi-piece board, the method comprising:
- providing a production panel comprising a frame having a plurality first coupling portions, and a plurality of piece portions each comprising a printed wiring board and a second coupling portion, the frame and the piece portions being spatially separated from each other on the production panel;
- physically separating the frame and the piece portions from the production panel;
- and
- combining the frame and the piece portions by coupling each of the first coupling portions of the frame to the second coupling portion of a respective piece portion to form the multi-piece board.
Dependencies are inferred from the claim text.