Disassembling an item by means of RF energy
AssigneeEmpire Technology Development LLC
InventorsEzekiel Kruglick, Mark Meloni
Life of this patent
Estimating the term…
Abstract
Technologies are generally described for providing inductively removable assembly bonding. Inductive elements may be placed strategically at bonding locations between two or more coupled components. At disassembly time, the elements may be heated through Radio Frequency (RF) energy causing the bonds to break and components to separate. For example, inductive elements placed near plastic stake bonds between dissimilar materials in an electronic device may be employed to separate the dissimilar materials during a recycling process. According to some examples, the elements may also be heated through a directly applied electric current via a network of connections designed into the assembly.
Claims14
A method for facilitating disassembly of an item that is attached to a component, the method comprising:
- wirelessly applying a first Radio Frequency (RF) energy to one or more embedded bosses located in the item to initiate deformation of the one or more embedded bosses located in the item, wherein each of the one or more embedded bosses includes an inductor that is configured to generate heat reactive to the first RF energy such that the embedded bosses are deformed, and wherein the item is attached to the component with the one or more embedded bosses;
- and
- separating the components from the item after the first RF energy initiates deformation of the one or more embedded bosses located in the item.
Dependencies are inferred from the claim text.