# US 8,572,412 B1 · Method and apparatus for warming up integrated circuits

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- Number: US 8,572,412 B1
- Document ID: US8572412B1
- Status: Granted
- Kind: B1
- Application number: 13/015,139
- Filed: 2011-01-27
- Granted: 2013-10-29
- Earliest claimed: 2010-02-01
- Assignees: Marvell Israel (M.I.S.L) Ltd.
- Applicants: Yosef Solt
- Inventors: Yosef Solt
- Web page: https://patentgrep.com/patent/US8572412B1

## CPC

- G11C 7/04: with means for avoiding disturbances due to temperature effects
- G06F 1/206: {comprising thermal management}
- G11C 29/50: Marginal testing, e.g. race, voltage or current testing
- G11C: STATIC STORES (semiconductor memory devices H10B)
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)

## Abstract

Aspects of the disclosure provide an integrated circuit (IC) chip. The IC chip includes functional circuits configured to perform desired functions when a chip temperature is higher than a threshold, such as a room temperature. The IC chip includes a warm-up module configured to warm-up the IC chip in a warm-up mode to raise the chip temperature above the threshold. A method for warming up an IC chip prior to operation is also disclosed.

## Claims

### Claim 1

An integrated circuit (IC) chip, comprising:
a plurality of functional circuits configured to perform desired functions when a chip temperature is higher than a threshold;
a warm-up module configured to warm-up the IC chip during a warm-up mode to raise the chip temperature above the threshold, a warming energy being supplied during the warm-up mode at least by performing an operation using a functional circuit, among the plurality of functional circuits, having another function that is not a warming function; and
a warm-up controller configured to generate a pseudo random bit sequence (PRBS) as inputs to the plurality of functional circuits and drive the plurality of functional circuits to warm up the IC chip.

### Claim 2 (depends on 1)

The IC chip of claim 1, wherein the warm-up module further comprises:
a warm-up determination unit configured to determine that the IC chip is warmed up.

### Claim 3 (depends on 2)

The IC chip of claim 2, wherein the warm-up determination unit comprises at least one of a timing element and a temperature-sensing element.

### Claim 4 (depends on 2)

The IC chip of claim 2, wherein the warm-up determination unit comprises at least one of a temperature sensing circuit, a thermal-diode and a ring oscillator for sensing the chip temperature.

### Claim 5 (depends on 1)

The IC chip of claim 1, wherein:
the plurality of functional circuits comprise memory circuits; and
the warm-up controller is configured to provide inputs to the memory circuits to drive the memory circuits to warm-up the IC chip.

### Claim 6 (depends on 5)

The IC chip of claim 5, wherein:
a memory built-in self-test (BIST) configured to generate memory test patterns to test the memory circuits; and
the warm-up controller is configured to control the memory BIST to provide memory test patterns to the memory circuits to warm up the IC chip.

### Claim 7 (depends on 1)

The IC chip of claim 1, wherein:
the plurality of functional circuits comprise logic circuits; and
the warm-up controller is configured to provide inputs to the logic circuits to drive the logic circuits to warm-up the IC chip.

### Claim 8 (depends on 7)

The IC chip of claim 7, wherein:
the logic circuits are scan-test enabled;
a built-in self-test (BIST) configured to generate test patterns to perform scan-test of the logic circuits; and
the warm-up controller is configured to control the BIST to provide the test patterns to the logic circuits to warm-up the IC chip.

### Claim 9 (depends on 1)

The IC chip of claim 1, wherein:
the plurality of functional circuits comprise a packet processor; and
the warm-up controller is configured to generate and provide packets to the packet processor for processing, and to use the packet processor to warm-up the IC chip.

### Claim 10

A method for warming up integrated circuits, comprising:
powering up a plurality of functional circuits on an integrated circuit (IC) chip in a warm-up mode, a warming energy supplied during the warm-up mode being supplied by performing an operation using a functional circuit of the plurality of functional circuits having another function that is not a warming function, the plurality of functional circuits being configured to perform desired functions in a normal operation mode related to a chip temperature;
driving at least a portion of the plurality of functional circuits to warm-up the IC chip until the chip temperature exceeds a threshold;
switching the IC chip into the normal operation mode;
generating pseudo random bit sequence (PRBS); and
providing the pseudo random bit sequence as inputs to the plurality of functional circuits.

### Claim 11 (depends on 10)

The method of claim 10, further comprising:
determining that the IC chip is warmed up based on a timing element.

### Claim 12 (depends on 10)

The method of claim 10, further comprising at least one of:
determining that the IC chip is warmed up using a temperature sensing circuit;
determining that the IC chip is warmed up based on a thermal diode; and
determining that the IC chip is warmed up based on monitoring a frequency of a ring oscillator.

### Claim 13 (depends on 10)

The method of claim 10, further comprising:
providing inputs to memory circuits to perform memory activities that warm up the IC chip.

### Claim 14 (depends on 13)

The method of claim 13, further comprising:
controlling a memory built-in self-test (BIST) to generate memory test patterns, and to provide the test patterns to the memory circuits to perform the memory activities.

### Claim 15 (depends on 10)

The method of claim 10, further comprising:
providing inputs to logic circuits to perform logic circuits activities that warm up the IC chip.

### Claim 16

The method of 15, further comprising:
controlling a built-in self-test (BIST) to generate test patterns to test the logic circuits.

### Claim 17 (depends on 10)

The method of claim 10, further comprising:
generating packets; and
providing the generated packets to a packet processor on the IC to perform packet processing activities that warm-up the IC.