Package for a neural stimulation device

An implantable device, comprising:

• a first electrically non-conductive substrate;
• a plurality of electrically conductive vias through said first electrically non-conductive substrate;
• a first flip-chip circuit attached to said first electrically non-conductive substrate using conductive bumps and electrically connected to at least a subset of said plurality of electrically conductive vias;
• a braze stop on said first electrically non-conductive substrate and along a periphery of said non-conductive substrate surrounding said plurality of conductive vias, and separating a braze joint from said plurality of conductive vias;
• a second flip-chip circuit electrically connected to said first flip-chip circuit;
• a second electrically non-conductive substrate attached to said second flip-chip circuit using conductive bumps;
• discrete passives attached to said second electrically non-conductive substrate;
• a cover bonded to said first electrically non-conductive substrate, said cover, said first electrically non-conductive substrate and said plurality of electrically conductive vias forming said implantable device;
• and
• said implantable device being hermetically sealed.