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US 8,571,405 B2Granted
Surface mount actuator
AssigneeDigitalOptics Corporation MEMS
InventorRoman C. Gutierrez
Life of this patent
Estimating the term…
Abstract
A silicon MEMS device can have at least one solder contact formed thereupon. The silicon MEMS device can be configured to be mounted to a circuit board via the solder contact(s). The silicon MEMS device can be configured to be electrically connected to the circuit board via the solder contact(s).
Claims30
A device comprising:
- a silicon MEMS device;
- at least one solder contact formed upon the MEMS device;
- at least one flexure attached to the MEMS device, the at least one flexure having the at least one solder contact formed thereon, the at least one flexure being comparatively stiff in a direction of motion of the MEMS device and the at least one flexure being comparatively soft in at least one other direction;
- and
- wherein the MEMS device is configured to be mounted to a circuit board and electrically connected to the circuit board via the at least one solder contact.
2 more elements
A system comprising:
- a circuit board;
- a MEMS actuator surface mounted to the circuit board via at least one solder contact formed thereon;
- at least one flexure attached to the actuator, the at least one flexure having the at least one solder contact formed thereon, the at least one flexure being comparatively stiff in a direction of motion of the actuator and the at least one flexure being comparatively soft in at least one other direction;
- a miniature camera;
- and
- wherein the actuator is configured to move an optical element of the miniature camera.
3 more elements
A method comprising:
- applying solder to pads of a circuit board;
- placing a silicon MEMS device upon circuit board such that solder contacts formed upon the MEMS device are substantially aligned with the pads of the circuit board;
- reflow soldering the MEMS device to the circuit board;
- and
- wherein at least one flexure is attached to the MEMS device, the at least one flexure has the at least one solder contact formed thereon, the at least one flexure is comparatively stiff in a direction of motion of the MEMS device and the at least one flexure is comparatively soft in at least one other direction.
2 more elements
Dependencies are inferred from the claim text.