# US 8,571,249 B2 · Silicon microphone package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,571,249 B2 - Document ID: US8571249B2 - Status: Granted - Kind: B2 - Application number: 12/786,723 - Filed: 2010-05-25 - Published: 2010-12-02 - Granted: 2013-10-29 - Earliest claimed: 2009-05-29 - Assignees: General Mems Corporation - Applicants: Yunlong Wang - Inventors: Yunlong Wang - Web page: https://patentgrep.com/patent/US8571249B2 ## CPC - H04R 19/005: {using semiconductor materials} - H04R 19/04: Microphones (H04R19/01 takes precedence) - H04R 31/00: Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)} - H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K) ## Abstract A silicon microphone package is provided, including an integrated microphone die having opposing first and second surfaces, a first cover member formed over the first surface of the integrated microphone die to form a first chamber therebetween, and a second cover member formed over the second surface of the integrated microphone die to form a second chamber therebetween. ## Claims ### Claim 1 A silicon microphone package, comprising: an integrated microphone die having opposing first and second surfaces, wherein the integrated microphone die comprises an acoustic sensing element formed in the integrated microphone die and a signal conditioning circuit formed in the integrated microphone die, and the signal conditioning circuit is at a side of the acoustic sensing element; a first cover member formed over the first surface of the integrated microphone die, forming a first chamber therebetween; and a second cover member formed over the second surface of the integrated microphone die, forming a second chamber therebetween, wherein the first and second cover members respectively comprise an enclosed conductive ring disposed around an edge portion of a surface thereof, contacting the first surface or the second surface of the integrated microphone die. ### Claim 2 (depends on 1) The silicon microphone package as claimed in claim 1, wherein the first cover member comprises a conductive layer electrically contacting the enclosed conductive ring. ### Claim 3 (depends on 1) The silicon microphone package as claimed in claim 1, wherein the second cover member comprises a conductive layer electrically contacting the enclosed conducive ring. ### Claim 4 (depends on 1) The silicon microphone package as claimed in claim 1, wherein the first cover member or the second cover member comprises an acoustic opening, wherein the acoustic opening allows acoustic waves to pass therethrough and contact the acoustic sensing element. ### Claim 5 (depends on 1) The silicon microphone package as claimed in claim 1, wherein the integrated microphone die comprise a cavity formed therein, and the cavity contacts one of the first and second chambers. ### Claim 6 (depends on 1) The silicon microphone package as claimed in claim 1, wherein the integrated microphone die comprises a continuous interconnect structure disposed around an edge portion of the integrated microphone die. ### Claim 7 (depends on 1) The silicon microphone package as claimed in claim 1, further comprising a solder pad formed over a surface of the first or second cover member not facing the integrated microphone die for surface mounting. ### Claim 8 A silicon microphone package, comprising: an integrated microphone die having opposing first and second surfaces, wherein the integrated microphone die comprises an acoustic sensing element formed in the integrated microphone die, a cavity, and a signal conditioning circuit formed in the integrated microphone die, and the signal conditioning circuit is at a side of the acoustic sensing element; a first cover member formed over the first surface of the integrated microphone die, forming a first chamber therebetween; an acoustic opening formed in a portion of the first cover member, partially exposing the integrated microphone die; and a second cover member formed over the second surface of the integrated microphone die, forming a second chamber therebetween, wherein the second chamber contacts the cavity of the integrated microphone die, and wherein the first and second cover members respectively comprise an enclosed conductive ring disposed around an edge portion of a surface thereof, contacting the first surface or the second surface of the integrated microphone die. ### Claim 9 (depends on 8) The silicon microphone package as claimed in claim 8, wherein the first cover member comprises a conductive layer electrically contacting the enclosed conductive ring. ### Claim 10 (depends on 8) The silicon microphone package as claimed in claim 8, wherein the second cover member comprises a conductive layer electrically contacting the enclosed conducive ring. ### Claim 11 (depends on 8) The silicon microphone package as claimed in claim 8, wherein the acoustic opening allows acoustic waves to contact the acoustic sensing element. ### Claim 12 (depends on 8) The silicon microphone package as claimed in claim 8, wherein the integrated microphone die comprises a continuous interconnect structure disposed around an edge portion of the integrated microphone die. ### Claim 13 (depends on 8) The silicon microphone package as claimed in claim 8, further comprising a solder pad formed over a surface of the first cover member not facing the integrated microphone die for surface mounting. ### Claim 14 (depends on 8) The silicon microphone package as claimed in claim 8, wherein the acoustic sensing element comprises a membrane and a perforated member with perforation holes therein. ### Claim 15 (depends on 14) The silicon microphone package as claimed in claim 14, wherein the perforated member with perforation holes therein is disposed in a location that is close to the acoustic opening. ### Claim 16 (depends on 14) The silicon microphone package as claimed in claim 14, wherein the membrane is disposed in a location that is close to the acoustic opening. ### Claim 17 A silicon microphone package, comprising: an integrated microphone die having opposing first and second surfaces, wherein the integrated microphone die comprises an acoustic sensing element formed in the integrated microphone die, a cavity, and a signal conditioning circuit formed in the integrated microphone die, and the signal conditioning circuit is at a side of the acoustic sensing element; a first cover member formed over the first surface of the integrated microphone die, forming a first chamber therebetween; a second cover member formed over the second surface of the integrated microphone die, forming a second chamber therebetween, wherein the second chamber contacts the cavity of the integrated microphone die; and an acoustic opening formed in a portion of the second cover member, partially exposing the integrated microphone die, wherein the first and second cover members respectively comprise an enclosed conductive ring disposed around an edge portion of a surface thereof, contacting the first surface or the second surface of the integrated microphone die. ### Claim 18 (depends on 17) The silicon microphone package as claimed in claim 17, wherein the first cover member comprises a conductive layer electrically contacting the enclosed conductive ring. ### Claim 19 (depends on 17) The silicon microphone package as claimed in claim 17, wherein the second cover member comprises a conductive layer electrically contacting the enclosed conducive ring. ### Claim 20 (depends on 17) The silicon microphone package as claimed in claim 17, wherein the acoustic opening allows acoustic waves through the cavity to contact the acoustic sensing element. ### Claim 21 (depends on 17) The silicon microphone package as claimed in claim 17, wherein the integrated microphone die comprises a continuous interconnect structure disposed around an edge portion of the integrated microphone die. ### Claim 22 (depends on 17) The silicon microphone package as claimed in claim 17, further comprising a solder pad formed over a surface of the first cover member not facing the integrated microphone die for surface mounting. ### Claim 23 (depends on 17) The silicon microphone package as claimed in claim 17, wherein the acoustic sensing element comprises a membrane and a perforated member with perforation holes therein. ### Claim 24 (depends on 23) The silicon microphone package as claimed in claim 23, wherein the perforated member with perforation holes therein is disposed in a location that is close to the cavity and the acoustic opening. ### Claim 25 (depends on 23) The silicon microphone package as claimed in claim 23, wherein the membrane is disposed in a location that is close to the cavity and the acoustic opening.