Wireless communication device and HAC module thereof
AssigneeChi Mei Communication Systems, Inc.
InventorsChang-Hsin Kuo, Chia-Ming Liang, Shih-Tsung Kan, Che-Yen Lin
Life of this patent
Estimating the term…
Abstract
An exemplary hearing aid compatibility (HAC) module includes an insulative substrate and a ground member. The substrate includes a first mounting surface, and a second mounting surface at opposite sides thereof, and a third mounting surface between the first mounting surface and the second mounting surface. The ground member includes two ground portions respectively attached to the first mounting surface and the second mounting surface, and a connecting portion attached to the third mounting surface. The connecting portion comprises two or more parts. One of the parts connects one of the ground portions, and another of the parts connects the other ground portion.
Claims16
A hearing aid compatibility (HAC) module, comprising:
- an insulative substrate including a first mounting surface and a second mounting surface at opposite sides thereof, and a third mounting surface between the first mounting surface and the second mounting surface;
- and
- a ground member including two ground portions respectively attached to the first mounting surface and the second mounting surface, and a connecting portion attached to the third mounting surface, the connecting portion comprising at least two parts, one of the at least two parts connecting one of the ground portions, and another of the at least two parts connecting the other ground portion;
- wherein the two ground portions are rotationally symmetric with respect to each other, if either ground portion is rotated 180 degrees about a center axis of the substrate, then it becomes identical to the other ground portion.
A wireless communication device, comprising:
- a circuit board including a first surface and a second surface at opposite sides thereof;
- a receiver mounted on the first surface;
- an antenna module mounted on the second surface;
- and
- a hearing aid compatibility (HAC) module mounted on the second surface to reduce electric and magnetic fields in the vicinity of the receiver, the HAC module comprising:
- a substrate including a first mounting surface and a second mounting surface at opposite sides thereof, and a third mounting surface between the first mounting surface and the second mounting surface;
- and
- a ground member including two ground portions respectively attached to the first mounting surface and the second mounting surface, and a connecting portion attached to the third mounting surface, the connecting portion comprising at least two parts, one of the at least two parts connecting one of the ground portions, and another of the at least two parts connecting the other ground portion;
- wherein the two ground portions are rotationally symmetric with respect to each other, if either ground portion is rotated 180 degrees about a center axis of the substrate, then it becomes identical to the other ground portion.
A hearing aid compatibility (HAC) module, comprising:
- an electrically insulative substrate including a first mounting surface and a second mounting surface at opposite ends thereof, and an elongated third mounting surface between the first mounting surface and the second mounting surface;
- and
- a metallic ground member including two ground portions and a connecting portion, the ground portions attached to the first mounting surface and the second mounting surface, respectively, and being rotationally symmetric with respect to each other, if either ground portion is rotated 180 degrees about a center axis of the substrate, then it becomes identical to the other ground portion, the connecting portion attached to the third mounting surface, the connecting portion comprising three parallel elongated strips, two outer of the three elongated strips connected to one of the ground portions, and the other intermediate one of the three elongated strips connected to the other ground portion.
Dependencies are inferred from the claim text.