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US 8,571,229 B2Granted
Semiconductor device
AssigneeMediatek Inc.
InventorsChien-Sheng Chao, Tse-Chi Lin, Yin-Chao Huang
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AssigneeMediatek Inc.
InventorsChien-Sheng Chao, Tse-Chi Lin, Yin-Chao Huang
Estimating the term…
A semiconductor device includes at least a die carried by a substrate, a plurality of bond pads disposed on the die, a plurality of conductive components, and a plurality of bond wires respectively connected between the plurality of bond pads and the plurality of conductive components. The plurality of bond pads respectively correspond to a plurality of signals, and include a first bond pad configured for transmitting/receiving a first signal and a second bond pad configured for transmitting/receiving a second signal. The plurality of conductive components include a first conductive component and a second conductive component. The first conductive component is bond-wired to the first bond pad, and the second conductive component is bond-wired to the second bond pad. The first conductive component and the second conductive component are separated by at least a third conductive component of the plurality of conductive components, and the first signal is asserted when the second signal is asserted.
A method for using a semiconductor device, the semiconductor device including at least a die carried by a substrate, a plurality of bond pads disposed on the die, a plurality of conductive components, and a plurality of bond wires respectively coupled between the plurality of bond pads and the plurality of conductive components, the plurality of bond pads respectively corresponding to a plurality of signals, the plurality of bond pads comprising a first bond pad configured for transmitting/receiving a first signal and a second bond pad configured for transmitting/receiving a second signal, the plurality of conductive components comprising a first conductive component and a second conductive component, where the first conductive component and the second conductive component are separated by at least a third conductive component of the plurality of conductive components;
A method for using a semiconductor device, the semiconductor device comprising at least a die carried by a substrate and a plurality of bond pads disposed on the die, the plurality of bond pads respectively corresponding to a plurality of signals, the plurality of bond pads comprising a first bond pad configured for transmitting/receiving a first signal and a second bond pad configured for transmitting/receiving a second signal, where the first bond pad and the second bond pad are separated by at least a third bond pad of the plurality of bond pads, and the method comprising:
A method for using a semiconductor device, the semiconductor device comprising at least a die carried by a substrate and a plurality of conductive components respectively corresponding to a plurality of signals, the plurality of conductive components comprising a first conductive component configured for transmitting/receiving a first signal and a second conductive component configured for transmitting/receiving a second signal, where the first conductive component and the second conductive component are separated by at least a third conductive component of the plurality of conductive components, and the method comprising:
Dependencies are inferred from the claim text.