# US 8,570,765 B2 · Circuit board with via hole and electronic device equipped with the same

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- Number: US 8,570,765 B2
- Document ID: US8570765B2
- Status: Granted
- Kind: B2
- Application number: 12/873,315
- Filed: 2010-08-31
- Published: 2012-03-01
- Granted: 2013-10-29
- Earliest claimed: 2010-08-31
- Assignees: ASUSTeK COMPUTER INC.
- Applicants: Cheng-Yu Wang; Chang-Hsu Yen
- Inventors: Cheng-Yu Wang; Chang-Hsu Yen
- Web page: https://patentgrep.com/patent/US8570765B2

## CPC

- H05K 1/0201: {Thermal arrangements, e.g. for cooling, heating or preventing overheating}
- G06F 1/1658: {related to the mounting of internal components, e.g. disc drive or any other functional module}
- H05K 2201/062: Means for thermal insulation, e.g. for protection of parts
- H05K 2201/09063: Holes or slots in insulating substrate not used for electrical connections
- H05K 2201/09854: Hole or via having special cross-section, e.g. elliptical
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)

## Abstract

A circuit board includes a main body, an electronic component, a fixing portion and at least one via hole. The electronic component and the fixing portion are disposed on the main body. The at least one via hole is formed on the main body and adjacent to the fixing portion.

## Claims

### Claim 1

An electronic device comprising:
a top casing with a first fixing portion;
a bottom casing with a second fixing portion;
a circuit board disposed between the top and bottom casings, the circuit board comprising:
a main body;
a third fixing portion disposed on the main body; and
at least one first hollow through hole formed on the main body and adjacent to the third fixing portion to form a thermal isolating; and
a fixing member passing through the first, second and third fixing portions so as to fix the circuit board between the top and bottom casings.

### Claim 2 (depends on 1)

The electronic device of claim 1, wherein the at least one first hollow through hole is circular, polygonal or groove-shaped.

### Claim 3 (depends on 1)

The electronic device of claim 1, wherein the circuit board further comprises an electronic component disposed on the main body.

### Claim 4 (depends on 3)

The electronic device of claim 3, further comprising at least one second hollow through hole formed on the main body and adjacent to the electronic component.

### Claim 5 (depends on 4)

The electronic device of claim 4, wherein the at least one second hollow through hole is circular, polygonal or groove-shaped.

### Claim 6

An electronic device comprising:
a top casing with a first fixing portion;
a bottom casing with a second fixing portion;
a circuit board disposed between the top and bottom casings, the circuit board comprising:
a main body;
a heat-generating electronic component disposed on the main body;
a third fixing portion disposed on the main body; and
at least one first hollow through hole formed on the main body and adjacent to the third fixing portion to form a first thermal isolating disposed between the third fixing portion and the heat-generating electronic component; and
a fixing member passing through the first, second and third fixing portions so as to fix the circuit board between the top and bottom casings.

### Claim 7 (depends on 6)

The electronic device of claim 6, further comprising at least one second hollow through hole formed on the main body and adjacent to the heat-generating electronic component to form a second thermal isolating disposed between the third fixing portion and the heat-generating electronic component.