# US 8,570,763 B2 · Method of forming hole for interlayer connection conductor, method of producing resin substrate and component-incorporated substrate, and resin substrate and component-incorporated substrate > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,570,763 B2 - Document ID: US8570763B2 - Status: Granted - Kind: B2 - Application number: 12/647,566 - Filed: 2009-12-28 - Published: 2010-04-29 - Granted: 2013-10-29 - Earliest claimed: 2007-07-06 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Yasuyuki Sekimoto - Inventors: Yasuyuki Sekimoto - Web page: https://patentgrep.com/patent/US8570763B2 ## CPC - H05K 3/0035: {of blind holes, i.e. having a metal layer at the bottom} - H05K 1/187: {the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier} - H05K 3/20: by affixing prefabricated conductor pattern {(H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence)} - H05K 3/244: {Finish plating of conductors, especially of copper conductors, e.g. for pads or lands (selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3465)} - H05K 3/3442: {having edge contacts, e.g. leadless chip capacitors, chip carriers} - H05K 3/3485: Application of solder paste, slurry or powder (using printing techniques to form the desired conductive pattern of the printed circuit by applying conductive material H05K3/12) - H05K 3/4602: {characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated} - H05K 2201/10636: Leadless chip, e.g. chip capacitor or resistor - H05K 2201/2054: Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics - H05K 2203/043: Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - Y02P 70/50: Manufacturing or production processes characterised by the final manufactured product - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract A high quality component-incorporated substrate achieves a sufficient connection between an in-plane electrode and an interlayer connection conductor at low cost. A method of forming a hole for an interlayer connection conductor of a resin substrate includes a step of forming an in-plane electrode in a core substrate, a step of forming a light reflective conductor for reflecting a laser beam applied on the in-plane electrode in a later step, a step of forming a resin layer so as to cover the core substrate, the in-plane electrode and the light reflective conductor, and a step of forming a hole for the interlayer connection conductor by removing the resin layer on the light reflective conductor through the use of a laser beam. ## Claims ### Claim 1 A resin substrate comprising: a core substrate including an in-plane electrode in a top surface thereof; a light reflective conductor having a smooth surface provided on the in-plane electrode, the smooth surface of the light reflective conductor having a curved convex shape; a resin layer arranged on the core substrate so as to cover the in-plane electrode and the light reflective conductor; and an interlayer connection conductor defined by a hole for an interlayer connection conductor that extends from a top surface of the resin layer to the light reflective conductor and that is covered or filled with a conductive material; wherein the light reflective conductor is made of a cream solder that has been applied on the in-plane electrode, melted, and hardened; and the light reflective conductor is provided on a portion of the in-plane electrode adjacent to or aligned with the hole in the resin layer but not on other portions of the in-plane electrode. ### Claim 2 A resin substrate comprising: a resin layer including an in-plane electrode in a bottom surface thereof; a light reflective conductor provided on the in-plane electrode and having a smooth surface defined by a top surface covered with the resin layer, the smooth surface of the light reflective conductor having a curved convex shape; and an interlayer connection conductor defined by a hole for an interlayer connection conductor that extends from a top surface of the resin layer to the light reflective conductor and that is covered or filled with a conductive material; wherein the light reflective conductor is made of a cream solder that has been applied on the in-plane electrode, melted, and hardened; and the light reflective conductor is provided on a portion of the in-plane electrode adjacent to or aligned with the hole in the resin layer but not on other portions of the in-plane electrode. ### Claim 3 A component-incorporated substrate comprising: a core substrate including an in-plane electrode in a top surface thereof; a mount component mounted on the in-plane electrode via a mounting conductor; a light reflective conductor provided in a region different from a mounting region of the mount component on the in-plane electrode, and having a smooth surface defined by a top surface, the smooth surface of the light reflective conductor having a curved convex shape; a resin layer arranged on the core substrate so as to cover the mounting conductor, the mount component and the light reflective conductor; and an interlayer connection conductor defined by a hole for an interlayer connection conductor that extends from a top surface of the resin layer to the light reflective conductor and that is covered or filled with a conductive material; wherein the light reflective conductor is made of a cream solder that has been applied on the in-plane electrode, melted, and hardened; and the light reflective conductor is provided on a portion of the in-plane electrode adjacent to or aligned with the hole in the resin layer but not on other portions of the in-plane electrode. ### Claim 4 A component-incorporated substrate comprising: a resin layer including an in-plane electrode in a bottom surface thereof; a mount component mounted on the in-plane electrode via a mounting conductor, and including a periphery covered with the resin layer; a light reflective conductor provided in a region different from a mounting region of the mount component on the in-plane electrode, and including a smooth surface defined by a top surface covered with the resin layer, the smooth surface of the light reflective conductor having a curved convex shape; and an interlayer connection conductor extending from a top surface of the resin layer to the light reflective conductor; wherein the light reflective conductor is made of a cream solder that has been applied on the in-plane electrode, melted, and hardened; and the light reflective conductor is provided on a portion of the in-plane electrode adjacent to or aligned with the hole in the resin layer but not on other portions of the in-plane electrode. ### Claim 5 (depends on 3) The component-incorporated substrate according to claim 3, wherein the mounting conductor is also made of the cream solder that has been melted and hardened. ### Claim 6 (depends on 4) The component-incorporated substrate according to claim 4, wherein the mounting conductor is also made of the cream solder that has been melted and hardened.