# US 8,570,748 B2 · Planar electrical power electronic modules for high-temperature applications, and corresponding production methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,570,748 B2 - Document ID: US8570748B2 - Status: Granted - Kind: B2 - Application number: 13/002,110 - Filed: 2009-06-16 - Published: 2011-05-12 - Granted: 2013-10-29 - Earliest claimed: 2008-07-02 - Assignees: Siemens Aktiengesellschaft - Applicants: Friedrich Lupp; Karl Weidner - Inventors: Friedrich Lupp; Karl Weidner - Web page: https://patentgrep.com/patent/US8570748B2 ## CPC - H10W 70/479: {on or in insulating or insulated package substrates, interposers, or redistribution layers} - H10W 70/688: {Flexible insulating substrates} - H10W 70/692: Ceramics or glasses - Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc. - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract With respect to an electronic component, in particular a power module, and in a corresponding method for producing or contact-connecting said component, the component (1) is fastened to an electrically insulating carrier film (3) having at least one first inorganic material and at least one opening (5) in which at least one electrical contact-connection (7) of the component (1) to outside the component (1) is provided. This makes it possible to provide electronic components (1), in particular power modules, for a temperature range of >175 DEG C. ## Claims ### Claim 1 An electronic component of a module, wherein the component is attached to an electrically-insulating carrier film comprising at least one first inorganic material, which has at least one opening in which at least one electrical contact-connection of the component to the outside is provided, wherein the at least one first inorganic material comprises exclusively inorganic or multi-bonded inorganic insulation materials. ### Claim 2 (depends on 1) The electronic component according to claim 1, further comprising: a fill layer comprising at least one second inorganic material for electrical insulation of the electronic components by means of a high-temperature package, with the fill layer filling spaces between the electronic component, carrier film and a leadframe, wherein the at least one second inorganic material comprises exclusively inorganic or multi-bonded inorganic insulation materials. ### Claim 3 (depends on 2) The electronic component according to claim 2, wherein at least one of the first and second inorganic material is a ceramic high-temperature material or a ceramic high-temperature material in an inorganic composite matrix. ### Claim 4 (depends on 2) The electronic component according to claim 2, wherein the first and or second inorganic material is at least one of glass, boron nitride, boron carbide, high-temperature cement, silicon nitride, mixed ceramic, aluminum oxide, silicon carbide and a ceramic adhesive. ### Claim 5 (depends on 2) The electronic component according to claim 2, wherein the fill layer has a multilayer structure. ### Claim 6 (depends on 5) The electronic component according to claim 5, wherein an adhesion agent is embodied between the individual layers to provide effective adhesion between the individual layers. ### Claim 7 (depends on 2) The electronic component according to claim 2, wherein a layer is applied to the fill layer for closing and healing the pores and tears of the last layer. ### Claim 8 (depends on 1) The electronic component according to claim 1, wherein the electrical contact-connection comprises at least one structured, flat, electrical conductor layer comprising at least one of Cu, Ni/Au, Ag, Sn—Ag in at least one of the opening and to at least one side of the electrically-insulating carrier film. ### Claim 9 (depends on 8) The electronic component according to claim 8, wherein the electrical contact-connection comprises, electrical contacting of the conductor layer to at least one leadframe which may consist of copper. ### Claim 10 (depends on 2) The electronic component according to claim 2, wherein the fill layer is looped back to the side of the component. ### Claim 11 (depends on 1) The electronic component according to claim 1, wherein at least one heat sink is applied to at least one of the electrical contact-connection and to the side of the component facing away from the carrier film. ### Claim 12 An electronic component of a module including a plurality of insulating materials, wherein the component is attached to an electrically-insulating carrier film which has at least one opening in which at least one electrical contact-connection of the component to the outside is provided, a fill layer comprising electrical insulation of the electronic components by means of a high-temperature package, with the fill layer filling spaces between the electronic component, carrier film and a leadframe, wherein the plurality of insulating materials comprise exclusively inorganic or multi-bonded inorganic insulation materials.