# US 8,570,747 B2 · Carbon laminated enclosure

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- Number: US 8,570,747 B2
- Document ID: US8570747B2
- Status: Granted
- Kind: B2
- Application number: 13/132,119
- Filed: 2008-12-04
- Published: 2011-09-29
- Granted: 2013-10-29
- Earliest claimed: 2008-12-04
- Assignees: Hewlett-Packard Development Company, L.P.
- Applicants: Chao-Wen Cheng; Mark H Ruch; Mark S Tracy
- Inventors: Chao-Wen Cheng; Mark H Ruch; Mark S Tracy
- Web page: https://patentgrep.com/patent/US8570747B2

## CPC

- H05K 7/20481: {characterised by the material composition exhibiting specific thermal properties}
- Y10T 428/13: Hollow or container type article [e.g., tube, vase, etc.]
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

An enclosure is provided. A housing (120) can have one or more walls (130). At least one of the one or more walls (130) can include a thermally conductive, carbonaceous member (100). The thermally conductive, carbonaceous member (100) can be partially or completely encapsulated within one or more electrically non-conductive materials.

## Claims

### Claim 1

An apparatus comprising:
a housing having one or more walls;
wherein all or a portion of at least one of the one or more walls comprises one or more thermally conductive, carbonaceous members,
wherein all or a portion of the one or more thermally conductive carbonaceous members comprises a sheet of aggregated carbon nanotubes.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein the one or more walls are arranged to form a partially or completely continuous peripheral wall having one or more surfaces disposed partially or continuously therebetween, wherein all or a portion of the one or more surfaces comprise the one or more thermally conductive carbonaceous members partially or completely encapsulated within one or more electrically non-conductive materials.

### Claim 3 (depends on 1)

The apparatus of claim 1, further comprising;
disposed, in, on, or about the housing, an electronic device selected from the group consisting of: a computer motherboard; a computer daughterboard; a cellular telephone motherboard; a personal data assistant motherboard; a liquid crystal display; a plasma display; and a light emitting diode display.

### Claim 4 (depends on 1)

The apparatus of claim 1, wherein an in-plane thermal conductivity of the one or more thermally conductive carbonaceous members is about 100 W/m-K or more; and, wherein a through-plane, or out-of-plane, thermal conductivity of the one or more thermally conductive carbonaceous members is less than about 100 W/m-K.

### Claim 5 (depends on 1)

The enclosure apparatus of claim 1, wherein a thickness of the one or more thermally conductive carbonaceous members can have a range of from about 0.1 mm to about 5 mm.

### Claim 6 (depends on 1)

The apparatus of claim 1, wherein a density of the one or more thermally conductive carbonaceous members can have a range of from about 0.25 g/cm3 to about 1.5 g/cm3.

### Claim 7

A method for dispersing heat generated by electrical devices disposed partially or completely within a housing, comprising:
disposing one or more heat generating electrical components within a housing, the housing comprising:
one or more walls, wherein at least a portion of the one of the one or more walls comprises a thermally conductive, carbonaceous material;
wherein the thermally conductive, carbonaceous material is partially or completely encapsulated within one or more non-conductive materials;
dispersing all or a portion of heat generated by the one or more heat generating electrical components evenly or unevenly across the thermally conductive, carbonaceous material; and
rejecting all or a portion of the heat transmitted to the thermally conductive, carbonaceous material from an exterior face of the housing, wherein a density of the heat rejected is substantially uniform across the thermally conductive, carbonaceous material,
wherein the thermally conductive, carbonaceous material comprises a sheet of aggregated carbon nanotubes.