# US 8,570,708 B2 · Ceramic electronic component

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- Number: US 8,570,708 B2
- Document ID: US8570708B2
- Status: Granted
- Kind: B2
- Application number: 13/527,671
- Filed: 2012-06-20
- Published: 2012-12-27
- Granted: 2013-10-29
- Earliest claimed: 2011-06-22
- Assignees: Murata Manufacturing Co., Ltd.
- Applicants: Yoji Itagaki; Jun Kotani
- Inventors: Yoji Itagaki; Jun Kotani
- Web page: https://patentgrep.com/patent/US8570708B2

## CPC

- H01G 4/30: Stacked capacitors (H01G4/33 takes precedence)
- H01G 2/06: specially adapted for mounting on a printed-circuit support
- H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor
- H01G 4/38: Multiple capacitors, i.e. structural combinations of fixed capacitors
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)

## Abstract

A ceramic electronic component includes two electronic-component main bodies and two metal terminals. Each of the metal terminals includes a base, ribs on left and right sides of the base, and a mounting portion below the base. The base includes two bonding portions to be bonded to respective external electrodes of the two electronic-component main bodies and cut-out portions each having a closed shape and being disposed below the respective bonding portions. The ribs are bent from the left and right sides of the base in the width direction toward the electronic-component main body. The ribs extend from the top of the base in the height direction to the vicinity of the mounting-side major surface of the mounting-side electronic-component main body and do not reach the mounting portion. The mounting portion is bent from the bottom of the base toward the electronic-component main body.

## Claims

### Claim 1

A ceramic electronic component comprising:
at least one electronic-component main body including two opposed major surfaces, two opposed end surfaces, two opposed side surfaces, and an external electrode that covers each of the two opposed end surfaces; and
a metal terminal connected to the external electrode of the electronic-component main body by a diffusion bond; wherein
the metal terminal includes a base, ribs, and a mounting portion, the ribs being bent from both left and right sides of the base in a width direction connecting the two end surfaces of the electronic-component main body to the electronic-component main body, the mounting portion being bent from a bottom of the base in a height direction connecting the two major surfaces of the electronic-component main body;
the base includes a bonding portion bonded to the external electrode of the electronic-component main body and at least one cut-out portion that has a closed shape and that is disposed below the bonding portion in the height direction, and a predetermined distance is set between the cut-out portion in the base and the mounting portion;
each of the ribs extends from a top of the base in the height direction to an area of a mounting-side major surface of the electronic-component main body and does not reach the mounting portion; and
the mounting portion is define by a single unseparated surface.

### Claim 2 (depends on 1)

The ceramic electronic component according to claim 1, wherein the cut-out portion extends around at least a partial perimeter of the bonding portion.

### Claim 3 (depends on 1)

The ceramic electronic component according to claim 1, wherein the cut-out portion is substantially U-shaped.

### Claim 4 (depends on 1)

The ceramic electronic component according to claim 1, wherein the at least one electronic-component main body comprises a plurality of electronic-component main bodies.

### Claim 5 (depends on 4)

The ceramic electronic component according to claim 4, wherein, when the at least one electronic-component main body comprises the plurality of electronic-component main bodies, the at least one cut-out portion comprises a plurality of cut-out portions each having a closed shape, each of the plurality of cut-out portions being disposed in an area of a bottom of a respective one of the plurality of electronic-component main bodies.

### Claim 6 (depends on 5)

The ceramic electronic component according to claim 5, wherein, of the plurality of cut-out portions, the cut-out portion adjacent to the mounting portion in a height direction of the metal terminal has the smallest width.

### Claim 7 (depends on 1)

The ceramic electronic component according to claim 1, wherein the external electrode of the electronic-component main body includes an exposed copper surface.