# US 8,570,288 B2 · Touch panel having light-shielding layer

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 8,570,288 B2
- Document ID: US8570288B2
- Status: Granted
- Kind: B2
- Application number: 12/732,193
- Filed: 2010-03-26
- Published: 2011-06-16
- Granted: 2013-10-29
- Earliest claimed: 2009-12-14
- Assignees: Wintek Corporation
- Applicants: Chih-Chang Lai; Shiao-Hui Liao; Yu-Hung Chang; Ping-Wen Huang; Ming-Kung Wu; Hsiao-Ping Li
- Inventors: Chih-Chang Lai; Shiao-Hui Liao; Yu-Hung Chang; Ping-Wen Huang; Ming-Kung Wu; Hsiao-Ping Li
- Web page: https://patentgrep.com/patent/US8570288B2

## CPC

- G06F 3/04164: {Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads}
- G06F 3/042: by opto-electronic means
- G02F 1/13338: {Input devices, e.g. touch panels}
- G06F 3/041: Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F 3/0412: {Digitisers structurally integrated in a display}
- G06F 3/0446: {using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes}
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS

## Abstract

A touch panel having a transparent region and a peripheral region surrounding the transparent region is provided. The touch panel includes a transparent cover, a touch device, a light-shielding layer, a layer of conductive lines, and a touch chip. The transparent cover has a touch surface and a device mounting surface opposite thereto. The touch device is disposed on the device mounting surface and at least located at the transparent region. The light-shielding layer is disposed on the transparent cover and located inside the peripheral region. The layer of conductive lines is disposed on the device mounting surface, located inside the peripheral region, and electrically connected to the touch device. The touch chip is disposed on the layer of conductive lines through a chip-on-glass process.

## Claims

### Claim 1

A touch panel with a transparent region and a peripheral region surrounding the transparent region comprising:
a transparent cover comprising a touch surface and a device mounting surface opposite thereto;
a touch device disposed on the device mounting surface and mainly located at the transparent region;
a light-shielding layer disposed on the transparent cover and located inside the peripheral region, and made of resin with a thickness from 0.5 μm to 6 μm;
a layer of conductive lines disposed on the device mounting surface, located inside the peripheral region, and electrically connected to the touch device;
a touch chip disposed on the layer of conductive lines through a chip-on-glass process; and
an anisotropic conductive film disposed between the layer of conductive lines and the touch chip, wherein the anisotropic conductive film comprises a plurality of conductive particles, and a diameter of each conductive particle is larger than a thickness of the light-shielding layer and the layer of conductive lines.

### Claim 2 (depends on 1)

The touch panel of claim 1, wherein the light-shielding layer is disposed on the device mounting surface and sandwiched between the layer of conductive lines and the transparent cover.

### Claim 3 (depends on 1)

The touch panel of claim 1, wherein the light-shielding layer is disposed on the touch surface.

### Claim 4 (depends on 1)

The touch panel of claim 1, wherein the light-shielding layer is made of diamond-like carbon.

### Claim 5 (depends on 1)

The touch panel of claim 1, wherein the light-shielding layer is made of black or white resin.

### Claim 6 (depends on 1)

The touch panel of claim 1, wherein the touch device comprises:
a plurality of first touch electrodes disposed on the device mounting surface wherein each first touch electrode extends along a first direction;
an insulator layer disposed on the device mounting surface and covering the first touch electrodes; and
a plurality of second touch electrodes disposed on a surface of the insulator layer away from the first touch electrodes wherein each second touch electrode extends along a second direction substantially perpendicular to the first direction.

### Claim 7 (depends on 6)

The touch panel of claim 6, wherein the first touch electrodes and the second touch electrodes are band-like electrodes.

### Claim 8 (depends on 6)

The touch panel of claim 6, wherein the first touch electrodes and the second touch electrodes are electrode series consisting of a plurality of diamond patterns.

### Claim 9 (depends on 1)

The touch panel of claim 1, wherein the touch device comprises:
a plurality of first touch electrodes disposed on the device mounting surface wherein each first touch electrode extends along a first direction; and
a plurality of second touch electrodes disposed on the device mounting surface to intersect the first touch electrodes wherein each second touch electrode extends along a second direction substantially perpendicular to the first direction.

### Claim 10 (depends on 9)

The touch panel of claim 9, wherein the first touch electrodes and the second touch electrodes are electrode series consisting of a plurality of diamond patterns.

### Claim 11 (depends on 10)

The touch panel of claim 10, wherein the first touch electrodes and the second touch electrodes comprise a plurality of connection pads overlapping the layer of conductive lines.

### Claim 12 (depends on 11)

The touch panel of claim 11, wherein the touch chip comprises a plurality of connection bumps electrically connected with the connection pads.

### Claim 13 (depends on 1)

The touch panel of claim 1, further comprising:
a flexible printed circuit board electrically connected to the layer of conductive lines.
