# US 8,570,234 B2 · Assembly of chip antenna and circuit board

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- Number: US 8,570,234 B2
- Document ID: US8570234B2
- Status: Granted
- Kind: B2
- Application number: 13/077,014
- Filed: 2011-03-31
- Published: 2011-12-01
- Granted: 2013-10-29
- Earliest claimed: 2010-05-31
- Assignees: Inpaq Technology Co., Ltd.
- Applicants: Meng Hsueh Tsai; Chih Ming Su; Lee Ting Hsieh
- Inventors: Meng Hsueh Tsai; Chih Ming Su; Lee Ting Hsieh
- Web page: https://patentgrep.com/patent/US8570234B2

## CPC

- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)}
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)

## Abstract

An assembly of a chip antenna and a circuit board includes a chip antenna and a circuit board. The circuit board includes a ground layer. The ground layer includes a hollow region formed adjacent to a periphery of the ground layer. The hollow region of the ground layer can be used for configuring an input impedance of the circuit board. The chip antenna is disposed in the hollow region of the ground layer, electrically connecting to the ground layer. The chip antenna includes input impedance. The input impedance of the chip antenna is adjustable to achieve a conjugate impedance match between the chip antenna and the circuit board such that the circuit board and the chip antenna can simultaneously radiate electromagnetic energy.

## Claims

### Claim 1

An assembly of a chip antenna and a circuit board, comprising:
a circuit board comprising a ground layer including a hollow region formed adjacent to a periphery of the ground layer, wherein an input impedance of the circuit board is configured by the hollow region of the ground layer; and
a chip antenna disposed in the hollow region of the ground layer, electrically connecting to the ground layer, including an input impedance;
wherein the input impedance of the chip antenna is adjustable to achieve a conjugate impedance match between the chip antenna and the circuit board, and the hollow region is configured to allow the circuit board and the chip antenna to simultaneously radiate electromagnetic energy;
wherein the chip antenna and the ground layer are disposed on the same surface of the circuit board.

### Claim 2 (depends on 1)

The assembly of claim 1, wherein the ground layer is rectangular, and the hollow region is adjacent to a long edge of the ground layer.

### Claim 3 (depends on 2)

The assembly of claim 2, wherein the hollow region is located adjacent to the center of the long edge.

### Claim 4 (depends on 2)

The assembly of claim 2, wherein the hollow region is at any position adjacent to a short edge or at any corner.

### Claim 5 (depends on 1)

The assembly of claim 1, wherein the hollow region has a shape of rectangle or regular polygon, or is irregular.

### Claim 6 (depends on 1)

The assembly of claim 1, further comprising a micro-strip line electrically connecting to a signal electrode.

### Claim 7 (depends on 6)

The assembly of claim 6, wherein the micro-strip line includes a feeding point for receiving an input signal.