# US 8,570,224 B2 · Apparatus providing thermal management for radio frequency devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,570,224 B2 - Document ID: US8570224B2 - Status: Granted - Kind: B2 - Application number: 12/778,922 - Filed: 2010-05-12 - Published: 2011-11-17 - Granted: 2013-10-29 - Earliest claimed: 2010-05-12 - Assignees: QUALCOMM Incorporated - Applicants: Eric Stephen Mattis - Inventors: Eric Stephen Mattis - Web page: https://patentgrep.com/patent/US8570224B2 ## CPC - H01Q 1/02: Arrangements for de-icing; Arrangements for drying-out {; Arrangements for cooling; Arrangements for preventing corrosion} - H01Q 1/241: {used in mobile communications, e.g. GSM (H01Q1/247, H01Q1/248 take precedence)} - H01Q 1/44: using equipment having another main function to serve additionally as an antenna {, e.g. means for giving an antenna an aesthetic aspect}(H01Q1/27 - H01Q1/34 take precedence) - H01Q 9/04: Resonant antennas - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract Apparatus providing thermal management for radio frequency devices. An antenna is provided that includes an antenna body configured for transmitting electrical signals, and one or more mounting surfaces coupled to the antenna body, the one or more mounting surfaces configured for mounting to a device surface so that a resulting thermal resistance (Rth) between the device surface and the antenna body is less than 15 degrees centigrade per watt. The antenna body forms one of a PIFA antenna, whip antenna, patch antenna, or a meandered patch antenna. ## Claims ### Claim 1 An antenna for thermal management in a device, the antenna comprising: an antenna body configured for transmitting electrical signals; one or more mounting surfaces coupled to the antenna body, the one or more mounting surfaces configured for mounting to a device surface, the one or more mounting surfaces sized to provide a thermal resistance (Rth) between the device surface and the antenna body that is less than 15 degrees centigrade per watt; and thermally conductive material coupled between the one or more mounting surfaces and the device surface to facilitate heat transfer. ### Claim 2 (depends on 1) The antenna of claim 1, wherein the one or more mounting surfaces are configured to mount to the device surface utilizing one or more connection types, respectively, wherein each of the one or more connection types is selected from a set consisting of: a solder connection, a pressure connection, and a capacitively coupled connection. ### Claim 3 (depends on 2) The antenna of claim 2, wherein the one or more mounting surfaces are coupled to one or more mounting feet, and the one or more mounting feet are coupled to the antenna body by one or more mounting legs so that the resulting thermal resistance is a combination of thermal resistances associated with the one or more connection types, the one or more mounting feet, and the one or more mounting legs. ### Claim 4 (depends on 3) The antenna of claim 3, wherein thermal resistances associated with the one or more connection types, the one or more mounting feet, and the one or more mounting legs are determined from Rth=t/(k*A), where t represents a material thickness in a heat flow direction, k is a thermal conductivity parameter, and A is a cross sectional area of the material perpendicular to the heat flow direction. ### Claim 5 (depends on 4) The antenna of claim 4, wherein the one or more connection types, the one or more mounting feet, and the one or more mounting legs are dimensioned so that the resulting thermal resistance in degrees centigrade per watt is in a range selected from a set of ranges consisting of: 15>Rth≧12, 12>Rth≧10, 10>Rth≧8, 8>Rth≧6, 6>Rth≧4, 4>Rth≧2, 2>Rth≧1, and 1>Rth≧5. ### Claim 6 (depends on 1) The antenna of claim 1, wherein at least one mounting surface is configured to conduct the electrical signals between the device surface and the antenna body. ### Claim 7 (depends on 1) The antenna of claim 1, wherein the antenna body forms one of a PIFA antenna, whip antenna, patch antenna, or a meandered patch antenna. ### Claim 8 An antenna apparatus for thermal management in a device, the apparatus comprising: an antenna body means for transmitting electrical signals; mounting means coupled to the antenna body means, the mounting means for mounting to a device surface, the mounting means sized to provide a thermal resistance between the device surface and the antenna body means that is less than 15 degrees centigrade per watt; and means for thermal conductivity coupled between the mounting means and the device surface to facilitate heat transfer. ### Claim 9 (depends on 8) The apparatus of claim 8, wherein the mounting means comprises connection means for mounting to the device surface. ### Claim 10 (depends on 9) The apparatus of claim 9, wherein the mounting means comprises mounting foot means for supporting the connection means and mounting leg means for mounting the mounting foot means to the antenna body means, so that the resulting thermal resistance is a combination of thermal resistances associated with the connection means, the mounting foot means, and the mounting leg means. ### Claim 11 (depends on 10) The apparatus of claim 10, wherein the connection means, the mounting foot means, and the mounting leg means are dimensioned so that the resulting thermal resistance in degrees centigrade per watt is in a range selected from a set of ranges consisting of: 15>Rth≧12, 12>Rth≧10, 10>Rth≧8, 8>Rth≧6, 6>Rth≧4, 4>Rth≧2, 2>Rth≧1, and 1>Rth≧5. ### Claim 12 A device comprising: a power amplifier (PA); an antenna body configured for transmitting electrical signals from the power amplifier; one or more mounting surfaces coupled to the antenna body, the one or more mounting surfaces configured for mounting to a device surface, the one or more mounting surfaces sized to provide a thermal resistance (Rth) between the device surface and the antenna body that is less than 15 degrees centigrade per watt; and thermally conductive material coupled between the one or more mounting surfaces and the device surface to facilitate heat transfer. ### Claim 13 (depends on 12) The device of claim 12, wherein the one or more mounting surfaces are configured to mount to the device surface by one or more connection types, respectively, wherein each of the one or more connection types is selected from a set consisting of: a solder connection, a pressure connection, and a capacitively coupled connection. ### Claim 14 (depends on 13) The device of claim 13, wherein the one or more mounting surfaces are coupled to one or more mounting feet, and the one or more mounting feet are coupled to the antenna body by one or more mounting legs so that the resulting thermal resistance is a combination of thermal resistances associated with the one or more connection types, the one or more mounting feet, and the one or more mounting legs. ### Claim 15 (depends on 14) The device of claim 14, wherein thermal resistances associated with the one or more connection types, the one or more mounting feet, and the one or more mounting legs are determined from Rth=t/(k*A), where t represents a material thickness in a heat flow direction, k is a thermal conductivity parameter, and A is a cross sectional area of the material perpendicular to the heat flow direction. ### Claim 16 (depends on 15) The device of claim 15, wherein the one or more connection types, the one or more mounting feet, and the one or more mounting legs are dimensioned so that the resulting thermal resistance in degrees centigrade per watt is in a range selected from a set of ranges consisting of: 15>Rth≧12, 12>Rth≧10, 10>Rth≧8, 8>Rth≧6, 6>Rth≧4, 4>Rth≧2, 2>Rth≧1, and 1>Rth≧5. ### Claim 17 (depends on 12) The device of claim 12, wherein the device surface is a circuit board comprising a power amplifier that is located within 120 millimeters of at least one mounting surface. ### Claim 18 (depends on 12) The device of claim 12, wherein the antenna body is exposed outside the device to dissipate heat energy to an ambient environment. ### Claim 19 (depends on 12) The device of claim 12, wherein the antenna body forms one of a PIFA antenna, whip antenna, patch antenna, or a meandered patch antenna. ### Claim 20 (depends on 12) The device of claim 12, wherein the device is a handheld device.