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US 8,570,075 B2Granted
Gate driver with digital ground
AssigneeNXP B.V.
InventorLuc van Dijk
Life of this patent
Estimating the term…
Abstract
Various exemplary embodiments relate to gate driver circuitry that compensate for parasitic inductances. Input buffers in the gate driver are grounded to an exposed die pad. Grounding may involve either a downbond or conductive glue.
Claims19
A system configured to supply power, the system comprising:
- a gate driver comprising at least one input buffer, at least one undervoltage monitor, at least one output driver, and an exposed die pad, wherein a ground of the at least one input buffer is coupled to the exposed die pad;
- a microcontroller coupled to the gate driver;
- a first ground coupled to both the exposed die pad and the microcontroller, wherein the first ground compensates for parasitic inductances of the at least one input buffer;
- and
- a second ground coupled to a connector of the gate driver.
2 more elements
A gate driver comprising:
- at least one input buffer;
- at least one undervoltage monitor;
- an exposed die pad that provides a digital ground;
- at least one output driver, wherein a ground of the at least one input buffer is coupled to the exposed die pad, wherein the at least one output driver includes a high output driver and a low output driver;
- and
- an output connector that provides an analog ground.
3 more elements
Dependencies are inferred from the claim text.