Semiconductor device and manufacturing method thereof

A semiconductor device comprising:

• at least one semiconductor element having electrode terminals;
• a metal plate supporting the semiconductor element;
• and
• a wiring board covering the semiconductor element and including a plurality of insulating layers and wiring layers alternately stacked and external connection terminals on a surface thereof, the wiring layers being electrically connected to each other by vias,
• wherein the electrode terminals and the external connection terminals are electrically connected via at least one of the wiring layers and the vias, and
• wherein at least one of the electrode terminals, the wiring layers, and the vias is electrically connected to the metal plate;
• wherein the electrode terminals and the metal plate are electrically connected to each other via a bonding wire.