Multiple die in a face down package

A system comprising a microelectronic package, comprising:

• (a) a subassembly including:
• a first substrate having oppositely-facing first and second surfaces;
• a first microelectronic element having a front surface facing the first surface of the first substrate, the first microelectronic element having a plurality of first contacts at the front surface thereof electrically connected with the first substrate;
• and
• a second microelectronic element having a front surface facing the second surface of the first substrate and overlying at least a portion of the front surface of the first microelectronic element, the second microelectronic element having a plurality of second contacts at the front surface thereof electrically connected with the first substrate;
• and
• (b) a second substrate having a first surface facing the subassembly and a second surface opposed thereto and an aperture extending between the first and second surfaces thereof, the second substrate having terminals configured for electrical interconnecting the microelectronic package with an external component;
• and
• (c) leads electrically connecting the subassembly with the second substrate, at least portions of the leads aligned with the aperture;
• and
• (d) a third microelectronic element having a front surface facing the first substrate and overlying at least a portion of the front surface of the first microelectronic element, the third microelectronic element having a plurality of third contacts at the front surface thereof electrically connected with the first substrate;
• and
• (e) one or more other electronic components electrically connected to the microelectronic assembly.