# US 8,569,882 B2 · Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,569,882 B2 - Document ID: US8569882B2 - Status: Granted - Kind: B2 - Application number: 13/071,397 - Filed: 2011-03-24 - Published: 2012-09-27 - Granted: 2013-10-29 - Earliest claimed: 2011-03-24 - Assignees: STATS ChipPAC, Ltd. - Applicants: WonJun Ko; Sungmin Song; Jong Wook Ju; JaEun Yun; Hye Ran Lee - Inventors: WonJun Ko; Sungmin Song; Jong Wook Ju; JaEun Yun; Hye Ran Lee - Web page: https://patentgrep.com/patent/US8569882B2 ## CPC - H10W 90/00: Package configurations - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H10W 72/5522: {comprising gold [Au]} - H10W 72/5524: {comprising aluminium [Al]} - H10W 72/859: {Bump connectors and bond wires} - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/20: Configurations of stacked chips - H10W 90/722: {between stacked chips} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; mounting a central integrated circuit over the base substrate; mounting a side package having a side package substrate along a peripheral region of the base substrate and laterally peripheral to the central integrated circuit with the side package substrate coplanar with the central integrated circuit; and encapsulating the central integrated circuit and the side package above the base substrate with a base encapsulation to form a planar surface over the central integrated circuit and the side package facing away from the base substrate. ## Claims ### Claim 1 A method of manufacture of an integrated circuit packaging system comprising: providing a base substrate; mounting a central integrated circuit over the base substrate; mounting a side package having side package substrate along a peripheral region of the base substrate and laterally peripheral to the central integrated circuit with the side package substrate coplanar and in direct contact with the central integrated circuit; forming a first vertical connector above the central integrated circuit; forming a second vertical connector over the side package substrate, wherein the first vertical connector and the second vertical connector are coplanar; and encapsulating the central integrated circuit and the side package above the base substrate with a base encapsulation to form a planar surface over the central integrated circuit and the side package facing away from the base substrate, the base encapsulation operable to partially encapsulate the first vertical connector and the second vertical connector such that the first vertical connector and the second vertical connector are exposed in the planar surface. ### Claim 2 (depends on 1) The method as claimed in claim 1 wherein: mounting the central integrated circuit includes mounting the central integrated circuit over the base substrate having a first height from the base substrate to the top of the central integrated circuit; and mounting the side package along the peripheral region of the base substrate includes mounting the side package having a second height from the base substrate to the top of the side package substrate and the second height is the same as the first height of the central integrated circuit. ### Claim 3 (depends on 1) The method as claimed in claim 1 further comprising: mounting a base integrated circuit over the base substrate below the central integrated circuit; and electrically connecting the base substrate to the side packages through the central integrated circuit. ### Claim 4 (depends on 1) The method as claimed in claim 1 further comprising: electrically connecting the side package to the base substrate with a first interconnect; electrically connecting the central integrated circuit to the side package with a second interconnect to create an electrical connection from the central integrated circuit to the base substrate through the side package substrate. ### Claim 5 (depends on 1) The method as claimed in claim 1 further comprising: electrically connecting a stacked package having a stacked package Integrated circuit through the planar surface to the side packages and electrically connected to the base substrate. ### Claim 6 (depends on 1) The method as claimed in claim 1 further comprising: electrically connecting the side packages through the central integrated circuit. ### Claim 7 (depends on 1) The method as claimed in claim 1 further comprising: electrically connecting the vertical connector to the side packages or the base substrate. ### Claim 8 (depends on 1) The method as claimed in claim 1 wherein: mounting the side packages includes mounting the side packages having a second side package substrate electrically connected to the central integrated circuit; and encapsulating the side packages includes partially encapsulating the second side package substrate. ### Claim 9 An integrated circuit packaging system comprising: a base substrate; a central integrated circuit mounted over the base substrate; a side package having a side package substrate mounted along a peripheral region of the base substrate and laterally peripheral to the central integrated circuit with the side package substrate coplanar and in direct contact with the central integrated circuit; a first vertical connector formed over the central integrated circuit; a second vertical connector formed over the side package substrate, wherein the first vertical connector and the second vertical connector are coplanar; and a base encapsulation encapsulating the central integrated circuit and the side package above the base substrate and forming a planar surface over the central integrated circuit and the side package facing away from the base substrate, wherein the first vertical connector and the second vertical connector are partially encapsulated in the base encapsulation and exposed in the planar surface. ### Claim 10 (depends on 9) The system as claimed in claim 9 wherein: the central integrated circuit has a first height from the base substrate to the top of the central integrated circuit; and the side package has a second height from the base substrate to the top of the side package substrate and the second height is the same as the first height of the central integrated circuit. ### Claim 11 (depends on 9) The system as claimed in claim 9 further comprising: a base integrated circuit mounted over the base substrate below the central integrated circuit; and wherein: the base substrate is electrically connected to the side packages through the central integrated circuit. ### Claim 12 (depends on 9) The system as claimed in claim 9 further comprising: a first interconnect electrically connecting the side package to the base substrate; and a second interconnect electrically connecting the central integrated circuit to the side package to create an electrical connection from the central integrated circuit to the base substrate through the side package substrate. ### Claim 13 (depends on 9) The system as claimed in claim 9 further comprising: a stacked package having a stacked package integrated circuit electrically connected through the planar surface to the side packages and electrically connected to the base substrate. ### Claim 14 (depends on 9) The system as claimed in claim 9 wherein the side package mounted along the peripheral region of the base substrate includes multiple side packages along the peripheral region and laterally peripheral to the central integrated circuit. ### Claim 15 (depends on 14) The system as claimed in claim 14 wherein: the side packages are electrically connected through the central integrated circuit. ### Claim 16 (depends on 14) The system as claimed in claim 14 wherein: the vertical connector is electrically connected to the side packages or the base substrate. ### Claim 17 (depends on 14) The system as claimed in claim 14 wherein: the side packages have a second side package substrate electrically connected to the central integrated circuit; and the base encapsulation partially encapsulates the second side package substrate.