# US 8,569,872 B2 · Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation

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- Number: US 8,569,872 B2
- Document ID: US8569872B2
- Status: Granted
- Kind: B2
- Application number: 12/166,169
- Filed: 2008-07-01
- Published: 2010-01-07
- Granted: 2013-10-29
- Earliest claimed: 2008-07-01
- Assignees: STATS ChipPAC, Ltd.
- Applicants: Henry Descalzo Bathan; Il Kwon Shim; Zigmund Ramirez Camacho; Philip Lyndon Cablao; Jose Alvin Caparas
- Inventors: Henry Descalzo Bathan; Il Kwon Shim; Zigmund Ramirez Camacho; Philip Lyndon Cablao; Jose Alvin Caparas
- Web page: https://patentgrep.com/patent/US8569872B2

## CPC

- H10W 70/411: {Chip-supporting parts, e.g. die pads}
- H10W 72/07554: {changes in dispositions}
- H10W 72/547: {Dispositions of multiple bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An integrated circuit package system includes: providing a die-pad with a predefined slot and an integrated circuit attached to the die-pad; connecting the integrated circuit to the die-pad with a bond wire; encapsulating the integrated circuit and the bond wire with an encapsulation; and partitioning the die-pad with partial saw isolation grooves along a single axis, and into a side pad, and a die attach pad.

## Claims

### Claim 1

A method for manufacturing an integrated circuit package system comprising:
providing a die-pad partitioned to a side pad and a die attach pad having an edge with a predefined slot collinear with the edge;
attaching an integrated circuit to the die-pad;
connecting the integrated circuit to the die-pad with a bond wire;
encapsulating the integrated circuit and the bond wire with an encapsulation; and
forming partial saw isolation grooves along a single axis of the encapsulation, the partial saw isolation grooves overlapping the predefined slot and separating the side pad from the die attach pad.

### Claim 2 (depends on 1)

The method as claimed in claim 1 wherein:
partitioning the die-pad creates corner pads connected with a strip on a bottom surface of the encapsulation.

### Claim 3 (depends on 1)

The method as claimed in claim 1 wherein:
partitioning the die-pad creates multiple die attach pads.

### Claim 4 (depends on 1)

The method as claimed in claim 1 wherein:
providing the die-pad with the predefined slot includes providing the predefined slot along a partial saw isolation path.

### Claim 5 (depends on 1)

The method as claimed in claim 1 wherein:
providing the die-pad with the predefined slot includes providing a die-pad with the predefined slots that are not coplanar.

### Claim 6

A method for manufacturing an integrated circuit package system comprising:
providing a lead-frame with a die-pad partitioned to a side pad and a die attach pad having an edge, die attach paddle bars, and a predefined slot collinear with the edge;
attaching an integrated circuit to the die-pad;
connecting the integrated circuit to the die-pad with a bond wire;
connecting the die-pad with an elevated lead-frame element;
encapsulating the integrated circuit and the bond wire with an encapsulation; and
forming partial saw isolation grooves along a single axis of the encapsulation, the partial saw isolation grooves overlapping the predefined slot and separating the side pad from the die attach pad.

### Claim 7 (depends on 6)

The method as claimed in claim 6 wherein:
connecting the die-pad with the elevated lead-frame element includes connecting the die-pad with a raised strip.

### Claim 8 (depends on 6)

The method as claimed in claim 6 further comprising:
etching half etched grooves along the partial saw isolation grooves while leaving un-etched depth indicator regions along the partial saw isolation grooves.

### Claim 9 (depends on 6)

The method as claimed in claim 6 wherein:
connecting the die-pad with the elevated lead-frame element includes connecting the die-pad with a side bar or an additional tie bar.

### Claim 10 (depends on 6)

The method as claimed in claim 6 wherein:
connecting the die-pad with the elevated lead-frame element includes connecting the die-pad with an elevated ring.

### Claim 11

An integrated circuit package system comprising:
a side pad;
a die attach pad adjacent to the side pad, the die attach pad having an edge;
a predefined slot collinear to the edge of the die attach pad;
an integrated circuit attached to the die attach pad;
a bond wire connected to the integrated circuit and to the die attach pad;
an encapsulation encapsulating the integrated circuit and the bond wire; and
partial saw isolation grooves along a single axis of the encapsulation, the partial saw isolation grooves overlapping the predefined slot.

### Claim 12 (depends on 11)

The system as claimed in claim 11 further comprising:
corner pads connected with a strip on a bottom surface of the encapsulation.

### Claim 13 (depends on 11)

The system as claimed in claim 11 wherein:
the partial saw isolation grooves adjacent to multiple die attach pads.

### Claim 14 (depends on 11)

The system as claimed in claim 11 wherein:
the predefined slot is along a partial saw isolation path.

### Claim 15 (depends on 11)

The system as claimed in claim 11 wherein:
the predefined slots are not coplanar.

### Claim 16 (depends on 11)

The system as claimed in claim 11 further comprising:
die attach paddle bars; and
an elevated lead-frame element, connected to the die attach paddle bars, above a bottom surface of the encapsulation.

### Claim 17 (depends on 16)

The system as claimed in claim 16 wherein:
the elevated lead-frame element is a raised strip.

### Claim 18 (depends on 16)

The system as claimed in claim 16 further comprising:
half etched grooves etched along the partial saw isolation grooves while leaving un-etched depth indicator regions along the partial saw isolation grooves.

### Claim 19 (depends on 16)

The system as claimed in claim 16 wherein:
the elevated lead-frame element is a side bar or an additional tie bar.

### Claim 20 (depends on 16)

The system as claimed in claim 16 wherein:
the elevated lead-frame element is an elevated ring.