Integrated circuit packaging system with shielding spacer and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsSinJae Lee, JongVin Park, Sung Jun Yoon, JiHoon Oh
Life of this patent
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a bottom integrated circuit over the substrate; connecting a bottom interconnect between the bottom integrated circuit and the substrate; and mounting a bottom shield-spacer above the bottom integrated circuit and the bottom shield-spacer includes a bottom shield plate above the bottom integrated circuit, a bottom shield pillar extending from a bottom shield foot and connected to the bottom shield plate, and a protuberance extending vertically above the bottom shield pillar and directly above the bottom shield foot.
Claims10
An integrated circuit packaging system comprising:
- a substrate;
- a bottom integrated circuit over the substrate;
- a bottom interconnect connected between the bottom integrated circuit and the substrate;
- and
- a bottom shield-spacer above the bottom integrated circuit and the bottom shield-spacer includes a bottom shield plate above the bottom integrated circuit, a bottom shield pillar extends from a bottom shield foot and connects to the bottom shield plate, and a protuberance extends vertically above the bottom shield pillar and directly above the bottom shield foot.
Dependencies are inferred from the claim text.